IP Library › Patent Application 18258467
Patent Application
App. No. 18/258,467

COMPOSITION AND SHEET

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Quick Facts
Patent No.
US None
App. No.
18/258,467
Abstract

A composition containing first hollow particles being thermally expandable hollow particles; second hollow particles being hollow particles other than the first hollow particles; and a polymerizable compound.

Claims (16)

1 . A composition comprising:

first hollow particles being thermally expandable hollow particles;

second hollow particles being hollow particles other than the first hollow particles; and

a polymerizable compound.

2 . The composition according to claim 1 , wherein the first hollow particles have an expansion initiation temperature of 70° C. or higher.

3 . The composition according to claim 1 , wherein the first hollow particles have an expansion initiation temperature of 260° C. or lower.

4 . The composition according to claim 1 , wherein the first hollow particles have a maximum expansion temperature of 100° C. or higher.

5 . The composition according to claim 1 , wherein the first hollow particles have a maximum expansion temperature of 290° C. or lower.

6 . A sheet comprising:

first hollow particles being thermally expandable hollow particles;

second hollow particles being hollow particles other than the first hollow particles; and

a matrix polymer.

7 . The sheet according to claim 6 , wherein the first hollow particles have an expansion initiation temperature of 70° C. or higher.

8 . The sheet according to claim 6 , wherein the first hollow particles have an expansion initiation temperature of 260° C. or lower.

9 . The sheet according to claim 6 , wherein the first hollow particles have a maximum expansion temperature of 100° C. or higher.

10 . The sheet according to claim 6 , wherein the first hollow particles have a maximum expansion temperature of 290° C. or lower.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 9, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066547/0677 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2023
From: HIGASHIUCHI, TOMOKO; YOKOTA, HIROSHI; FURUKAWA, NAOKI; MATSUBARA, NOZOMI
To: RESONAC CORPORATION
Reel/Frame 064384/0450 →