Resin composition, prepreg laminate obtained with the same and printed-wiring board

1. A resin composition comprising (a) a maleimide compound having at least two N-substituted maleimide groups in a molecular structure and (b) a silicone compound having at least one reactive organic group in a molecular structure,

wherein the reactive organic group of the (b) silicone compound is at least one selected from an epoxy group, an amino group, a hydroxyl group, a methacryl group, a mercapto group, a carboxyl group, and an alkoxy group,

wherein the (b) silicone compound is a silicone compound containing a structure represented by general formula (II):

wherein each of R 3 and R 4 independently represents an alkyl group, a phenyl group, or a substituted phenyl group; and n represents an integer of 1 to 100, and

further comprising (d) an amine compound having an acidic substituent represented by general formula (I):

each R 1 independently represents a hydroxyl group, a carboxyl group, or a sulfonic acid group as an acidic substituent; each R 2 represents a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5, or a halogen atom; and x represents an integer of 1 to 5 and y represents an integer of 0 to 4, with the proviso that x+y=5.

2. The resin composition according to claim 1 , further comprising (c) a thermosetting resin.

3. The resin composition according to claim 2 , wherein the component (c) is a thermosetting resin having an epoxy group and/or a cyanate group in a molecular structure.

4. The resin composition according to claim 2 , further comprising (f) an inorganic filler.

5. The resin composition according to claim 1 , wherein the silicone compound has at least two reactive organic groups in a molecular structure.

6. The resin composition according to claim 1 , wherein the silicone compound has a reactive organic group on both ends.

7. The resin composition according to claim 1 , wherein the silicone compound has a reactive organic group on either end.

8. The resin composition according to claim 1 , wherein the silicone compound has a reactive organic group in the side chain.

9. The resin composition according to claim 1 , wherein the silicone compound has a reactive organic group in the side chain and on at least one end.

10. The resin composition according to claim 1 , further comprising (e) a curing accelerator represented by formula (III) or (IV):

wherein each of R 6 , R 7 , R 8 , and R 9 independently represents a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5, or a phenyl group; and D represents an alkylene group or an aromatic hydrocarbon group; and

wherein each of R 6 , R 7 , R 8 , and R 9 independently represents a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of 1 to 5, or a phenyl group; and B represents single bond or any one of an alkylene group, an alkylidene group, an ether group, and a sulfonyl group.

11. The resin composition according to claim 1 , further comprising (f) an inorganic filler.

12. A prepreg manufactured by impregnating or coating a substrate with the resin composition according to claim 1 , followed by semi-curing (B-staging) by heating.

13. A laminate plate obtained by laminating and molding the prepreg according to claim 12 .

14. A printed wiring board manufactured by forming a circuit on a surface of the laminate plate according to claim 13 .

15. The resin composition according to claim 1 , which includes 1 to 100 parts by mass of said silicone compound based on 100 parts by mass of said maleimide compound.

16. The resin composition according to claim 15 , which includes 0.1 to 20 parts by mass of said amine compound based on 100 parts by mass of said maleimide compound.