IP Library Assignment 028312/0217
Patent Assignment
Reel/Frame 028312/0217

Assignment of Assignor's Interest

Recorded: 2012-06-04 Pages: 2
Assignors
MIYATAKE, MASATO
Executed: 2012-03-29
KOTAKE, TOMOHIKO
Executed: 2012-03-29
NAGAI, SHUNSUKE
Executed: 2012-03-29
HASHIMOTO, SHINTARO
Executed: 2012-03-29
INOUE, YASUO
Executed: 2012-03-29
TAKANEZAWA, SHIN
Executed: 2012-03-29
MURAI, HIKARI
Executed: 2012-03-29
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property (1)
Resin Composition, Prepreg Laminate Obtained with the Same and Printed-Wiring Board
Patent: 8,735,733 →
Application: 13/352,819 →
Publication: US 2012/0247820
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →