Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing wiring board
View Patent ↗Provided is a photosensitive resin composition, including: a binder polymer; a photopolymerizable compound having an ethylenically unsaturated group; a photopolymerization initiator; a benzotriazole compound; and an aliphatic diamine compound having from 8 to 30 carbon atoms.
1. A photosensitive resin composition, comprising:
a binder polymer;
a photopolymerizable compound having an ethylenically unsaturated group;
a photopolymerization initiator;
a benzotriazole compound; and
an aliphatic diamine compound having from 8 to 30 carbon atoms.
2. The photosensitive resin composition according to claim 1 , further comprising at least one selected from the group consisting of triazole compounds and tetrazole compounds.
3. A photosensitive element, comprising:
a support; and
a photosensitive layer that is formed on the support and is a coating film composed of the photosensitive resin composition according to claim 2 .
4. A method of forming a resist pattern, the method comprising:
a lamination step of laminating the photosensitive element according to claim 3 on a substrate such that the photosensitive layer faces the substrate;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.
5. A method of forming a resist pattern, the method comprising:
a photosensitive layer-forming step of forming a photosensitive layer on a substrate by applying the photosensitive resin composition according to claim 2 .
6. A photosensitive element, comprising:
a support; and
a photosensitive layer that is formed on the support and is a coating film composed of the photosensitive resin composition according to claim 1 .
7. A method of forming a resist pattern, the method comprising:
a lamination step of laminating the photosensitive element according to claim 6 on a substrate such that the photosensitive layer faces the substrate;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.
8. A method of producing a wiring board, the method comprising a step of performing an etching treatment or a plating treatment on a substrate on which a resist pattern is formed by the method of forming a resist pattern according to claim 7 .
9. A method of forming a resist pattern, the method comprising:
a photosensitive layer-forming step of forming a photosensitive layer on a substrate by applying the photosensitive resin composition according to claim 1 ;
an exposure step of exposing at least a portion of the photosensitive layer to an active light beam to form a photo-cured portion in the photosensitive layer; and
a development step of removing a portion other than the photo-cured portion.
10. A method of producing a wiring board, the method comprising a step of performing an etching treatment or a plating treatment on a substrate on which a resist pattern is formed by the method of forming a resist pattern according to claim 9 .