IP Library Assignment 034248/0340
Patent Assignment
Reel/Frame 034248/0340

Assignment of Assignor's Interest

Recorded: 2014-11-24 Pages: 2
Assignors
ITAGAKI, KATSUTOSHI
Executed: 2014-10-07
SHINDOU, MASANORI
Executed: 2014-10-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Wiring Board
Patent: 9,110,371 →
Application: 14/403,233 →
Publication: US 2015/0153647
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →