Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element
A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
1. A resin composition comprising:
(a) an acrylic polymer having a weight-average molecular weight ranging from 100000 to 3000000,
(b) a monofunctional (meth)acrylic compound,
(c) a polymerization initiator, and
(d) an antioxidant
wherein an absolute value of refractive index difference between the (a) acrylic polymer and the (b) monofunctional (meth)acrylic compound at 100° C. is 0.031 or less.
2. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (I)
where A represents an alicyclic group having 5 to 22 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.
3. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (II)
where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.
4. The resin composition according to claim 1 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (III)
where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.
5. The resin composition according to claim 1 , for use in optical parts.
6. A method for manufacturing a semiconductor device comprising:
a step of forming an adhesive layer of the resin composition according to claim 1 on a semiconductor substrate,
a step of sandwiching the adhesive layer between the semiconductor substrate and a transparent substrate, and applying pressure onto the semiconductor substrate and the transparent substrate for bonding, and
a step of curing the adhesive layer.
7. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 1 .
8. The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (II)
where Y represents a linear or branched alkyl group having 1 to 10 carbon atoms optionally having a substituent; and R represents a hydrogen atom or a methyl group.
9. The resin composition according to claim 2 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (III)
where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.
10. The resin composition according to claim 3 , wherein the (a) acrylic polymer contains at least one structural unit represented by the following formula (III)
where Z represents a group containing at least one functional group selected from the group consisting of a carboxyl group, a hydroxyl group, an acid anhydride group, an amino group, an amide group, an epoxy group and a nitrile group; and R represents a hydrogen atom or a methyl group.
11. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 2 .
12. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 3 .
13. A solid-state imaging element comprising:
a semiconductor substrate having a light receiving section provided on the upper surface,
an adhesive layer provided on the semiconductor substrate so as to cover the light receiving section, and
a transparent substrate bonded to the semiconductor substrate by the adhesive layer, wherein
the adhesive layer is formed of the resin composition according to claim 4 .
14. An optical part comprising a cured form of the resin composition according to claim 1 .