Patent Assignment
Reel/Frame 053776/0643
Assignment of Assignor's Interest
Recorded: 2020-09-15
Pages: 4
Assignor
KATO, SADAAKI
Executed: 2020-09-15
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Resin Composition, Method for Manufacturing Semiconductor Device Using Resin Composition, and Solid-State Imaging Element
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 18, 2020
From: KATOU, SADAAKI; KIMURA, MIKA; IKEDA, AYA; FUJII, SHINJIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 052975/0015 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →