IP Library Granted Patent US 11,149,109
Granted Patent B2
US 11,149,109 · App. 16/311,966 · Granted Oct 19, 2021

Epoxy resin composition, cured product and composite material

Inventors: Yuka Yoshida (Tokyo, JP); Kazumasa Fukuda (Tokyo, JP); Yoshitaka Takezawa (Tokyo, JP)
Assignee: SHOWA DENKO MATERIALS CO., LTD.
C08G59/245C08G59/5033C08L63/00C08K3/04C08K7/06
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Quick Facts
Patent No.
US 11,149,109
App. No.
16/311,966
Granted
Oct 19, 2021
Kind
B2
Abstract

An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring.

Claims (13)

1. An epoxy resin composition that comprises an epoxy resin and a curing agent,

the epoxy resin comprising an epoxy compound that has, in one molecule, two structural units represented by the following Formula (I) and two or more epoxy groups, present in a content of up to 20% by mass of the total epoxy resin:

wherein, in Formula (I), each of R1 to R4 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and

the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring.

2. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition is capable of forming a smectic structure in a cured state.

3. A cured product of the epoxy resin composition according to claim 1 .

4. A composite material comprising the cured product according to claim 3 and a reinforcing material.

5. The composite material according to claim 4 , wherein the reinforcing material comprises a carbon material.

6. The epoxy resin composition according to claim 1 , wherein the epoxy compound that has, in one molecule, two structural units represented by the Formula (I) and two or more epoxy groups, is contained in a content of 10% by mass or more and 20% by mass or less of the total epoxy resin.

7. The epoxy resin composition according to claim 1 , wherein the epoxy compound that has, in one molecule, two structural units represented by the Formula (I) and two or more epoxy groups, is contained in a content of 15% by mass or more and 20% by mass or less of the total epoxy resin.

8. The epoxy resin composition according to claim 1 , wherein the epoxy compound that has, in one molecule, two structural units represented by the Formula (I) and two or more epoxy groups, is contained in a content of 20% by mass of the total epoxy resin.

9. The epoxy resin composition according to claim 1 , wherein the epoxy compound that has, in one molecule, two structural units represented by the Formula (I) and two or more epoxy groups, comprises at least one selected from the group consisting of the compounds represented by the following Formulae (II-A) to (II-C):

wherein, in Formulae (II-A) to (II-C), each of R 1 to R 4 independently represents a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, each of R 5 independently represents an alkyl group having 1 to 8 carbon atoms, and n represents an integer of 0 to 4.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF NAME Recorded Feb 8, 2021
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 055256/0767 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2019
From: YOSHIDA, YUKA; FUKUDA, KAZUMASA; TAKEZAWA, YOSHITAKA
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 048704/0011 →