IP Library › Granted Patent US 656,909
Granted Patent S1
US 656,909 · App. 29/389,788 · Granted Apr 3, 2012

Adhesive tape for semiconductor manufacturing

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Quick Facts
Patent No.
US 656,909
App. No.
29/389,788
Granted
Apr 3, 2012
Kind
S1
Claims (1)

The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2011
From: TANIGUCHI, KOUHEI; MATSUZAKI, TAKAYUKI; KATOU, SHINYA; KOMORIDA, KOUJI; MASHINO, MICHIO; SAKUTA, TATSUYA; KATOU, RIE
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026655/0265 →