Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

1. A method for producing a semiconductor chip with an adhesive film, comprising steps of:

preparing a laminate in which a semiconductor wafer, an adhesive film for a semiconductor and a dicing tape are laminated in that order, the adhesive film for a semiconductor having a thickness in the range of 1 to 15 μm and a tensile elongation at break of less than 5%, and the tensile elongation at break being less than 110% of the elongation at a maximum load, and the semiconductor wafer having a reformed section for dividing the semiconductor wafer into a plurality of semiconductor chips, which is formed by irradiating with laser light;

dividing the semiconductor wafer into the plurality of semiconductor chips without dividing the adhesive film for a semiconductor by expanding the dicing tape in a direction in which the plurality of semiconductor chips are each separated;

and dividing the adhesive film for a semiconductor by picking up the plurality of semiconductor chips in a laminating direction of the laminate, thereby preparing a semiconductor chip with an adhesive film.

2. A method for producing a semiconductor device, comprising a step of bonding a semiconductor chip with an adhesive film obtained by the method according to claim 1 to another semiconductor chip or a semiconductor chip mounting support member.