Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
View Patent ↗There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).
1. An adhesive composition, comprising electroconductive particles (A) and a binder component (B),
wherein the electroconductive particles (A) comprise a metal (a1) having a melting point equal to or higher than a reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and
the binder component (B) comprises a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2),
wherein the thermosetting resin composition (b1) comprises an epoxy resin, and
the aliphatic dihydroxycarboxylic acid (b2) is an aliphatic dihydroxycarboxylic acid represented by the following general formula (1):
wherein R 1 is an alkyl group which may have a substituent, and n and m are each an integer of 0 to 5, and
wherein the content of the aliphatic dihydroxycarboxylic acid (b2) is 0.1 part or more by weight and 20 parts or less by weight for 100 parts by weight of the metal (a2) having the melting point lower than the reflow temperature and containing no lead.
2. The adhesive composition according to claim 1 , wherein the reflow temperature is a temperature for mounting with SnAgCu cream solder.
3. The adhesive composition according to claim 1 , wherein the reflow temperature is 260° C.
4. The adhesive composition according to claim 1 , wherein the epoxy resin is an epoxy resin derived from bisphenol F.
5. The adhesive composition according to claim 1 , wherein the metal (a1) having the melting point equal to or higher than the reflow temperature and containing no lead is silver-coated copper powder, and the metal (a2) having the melting point lower than the reflow temperature and containing no lead is Sn42-Bi58.
6. An electronic-component-mounted substrate having a structure wherein a substrate and an electronic component are bonded to each other through the adhesive composition as recited in claim 1 .
7. A semiconductor device having a structure wherein a semiconductor element and a semiconductor-element-mounting supporting member are bonded to each other through the adhesive composition as recited in claim 1 .
8. An electronic-component-mounted substrate having a structure wherein a substrate and an electronic component are bonded to each other through the adhesive composition as recited in claim 2 .
9. A semiconductor device having a structure wherein a semiconductor element and a semiconductor-element-mounting supporting member are bonded to each other through the adhesive composition as recited in claim 2 .