Patent Assignment
Reel/Frame 024165/0318
Assignment of Assignor's Interest
Recorded: 2010-03-31
Pages: 2
Assignors
KONNO, KAORU
Executed: 2010-02-05
HAYASHI, HIROKI
Executed: 2010-02-05
KAWAMORI, TAKASHI
Executed: 2010-02-05
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Adhesive Composition, Electronic-Component-Mounted Substrate and Semiconductor Device Using the Adhesive Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Dec 11, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 037268/0738 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →