Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): wherein R 1 represents an electron-donating group.
1. An adhesive for a semiconductor, comprising an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, at least one compound selected from a group consisting of methylsuccinic acid, 2-methylglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers,
wherein a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
2. The adhesive for a semiconductor according to claim 1 , wherein the at least one compound is a fluxing agent.
3. The adhesive for a semiconductor according to claim 1 , wherein the phenoxy resin has a weight average molecular weight of 10000 or more.
4. The adhesive for a semiconductor according to claim 1 , wherein the adhesive has a film shape.
5. A fluxing agent, comprising at least one compound selected from a group consisting of methylsuccinic acid, 2-methyiglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid, wherein the fluxing agent is blended in an adhesive for a semiconductor comprising an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, the fluxing agent in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers, and a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
6. A manufacturing method for a semiconductor device, wherein connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or connection portions of a plurality of semiconductor chips are electrically connected to each other,
the method comprising a step of sealing at least part of the connection portions with the adhesive for a semiconductor according to claim 1 .
7. A semiconductor device prepared by the manufacturing method according to claim 6 .
8. The adhesive for a semiconductor according to claim 1 , wherein the adhesive has an insulation property.
9. The fluxing agent according to claim 5 , wherein the adhesive has an insulation property.
10. A fluxing agent, comprising at least one compound selected from a group consisting of methylsuccinic acid, 2-methyiglutaric acid, 2-methyladipic acid, 2-methylpimelic acid, and 2-methylsuberic acid, wherein the fluxing agent is configured to be blended in an adhesive for a semiconductor such that the adhesive comprises an epoxy resin in an amount of 5 to 75% by mass based on the total amount of the adhesive, a curing agent, a phenoxy resin, the fluxing agent in an amount of 0.5 to 10% by mass based on the total amount of the adhesive, and resin fillers, and a mass ratio of the content of the epoxy resin to the content of the phenoxy resin is 0.01 to 5.
11. The adhesive for a semiconductor according to claim 1 , wherein the resin fillers comprise at least one selected from the group consisting of a polyurethane resin and a polyimide resin.
12. The fluxing agent according to claim 5 , wherein the resin fillers comprise at least one selected from the group consisting of a polyurethane resin and a polyimide resin.
13. The fluxing agent according to claim 10 , wherein the resin fillers comprise at least one selected from the group consisting of a polyurethane resin and a polyimide resin.