Adhesion assisting agent fitted metal foil, and printed wiring board using thereof
View Patent ↗Provided is an adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin selected from the group consisting of a novolak epoxy resin and an aralkyl epoxy resin; and (C) an epoxy resin curing agent.
1. An adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less,
wherein the adhesion assisting agent layer is formed from an adhesion assisting agent composition comprising: (A) an epoxy resin which comprises a novolak epoxy resin, the component (A) having a biphenyl structure; and (C) an epoxy resin curing agent, and
wherein the adhesion assisting agent composition further comprises (B) a polymer which is able to be chemically roughened, selected from the group consisting of cross-linked rubber particles, polyvinyl acetal resin and a carboxylic acid modified polyvinyl acetal resin, and (D) a curing accelerator.
2. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (B) is cross-linked rubber particles.
3. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (B) is selected from the group consisting of acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, and particles having a butadiene rubber core and an acrylic resin shell.
4. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (B) is selected from the group consisting of a polyvinyl acetal resin and a carboxylic acid modified polyvinyl acetal resin.
5. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the amount of the component (B) is from 0.5 to 25 parts by weight for 100 parts by weight of the component (A).
6. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (C) is a phenol novolak resin.
7. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (C) is a triazine-ring-containing phenol novolak resin.
8. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the surface of the metal is not subjected to any roughening treatment for promoting adhesive force.
9. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the metal is copper foil subjected to rust preventing treatment with at least one selected from zinc, chromium, nickel and oxide thereof.
10. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the surface of the metal is subjected to silane coupling treatment.
11. A printed-wiring board produced by use of the metal foil according to claim 1 , wherein the peeling strength between the adhesion assisting agent layer adhering to an insulating layer and an electroconductive circuit is 0.6 kN/m or more at 20° C.
12. A printed-wiring board having any one of a through hole structure and an interstitial via hole structure, which is produced by use of the adhesion assisting agent fitted metal foil according to claim 1 , a first plating being formed by electroless copper plating when the through hole structure or the interstitial via hole structure is formed.
13. The adhesion assisting agent fitted metal foil according to claim 1 , wherein the component (C) comprises an aralkyl resin having a phenolic hydroxyl group.
14. The adhesion assisting agent fitted metal foil according to claim 13 , wherein the component (C) further comprises 3 to 50% by equivalent of a triazine-ring-containing novolak resin having a phenolic hydroxyl group.
15. The adhesion assisting agent fitted metal foil according to claim 13 , wherein the amount of the component (B) is from 0.5 to 25 parts by weight for 100 parts by weight of the component (A).
16. The adhesion assisting agent fitted metal foil according to claim 13 , wherein the component (B) is selected from the group consisting of acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, particles having a butadiene rubber core and an acrylic resin shell, polyvinyl acetal resin, and carboxylic acid modified polyvinyl acetal resin.
17. The adhesion assisting agent fitted metal foil according to claim 13 , wherein the surface of the metal foil is not subjected to any roughening treatment.
18. The adhesion assisting agent fitted metal foil according to claim 13 , wherein the metal foil is copper foil subjected to rust preventing treatment with at least one selected from the group consisting of nickel, tin, zinc, chromium, molybdenum, cobalt and oxide thereof.
19. A printed-wiring board, which is produced by using the adhesion assisting agent fitted metal foil according to claim 1 .
20. A process for producing a printed-wiring board, which comprises the step of using the adhesion assisting agent fitted metal foil according to claim 1 .
21. An adhesion assisting agent fitted metal foil, comprising an adhesion assisting agent layer having a thickness of 0.1 to 10 μm on a metal whose surface has a ten-point average roughness Rz of 2.0 μm or less, and the surface of the adhesion assisting agent layer is able to undergo electroless plating by roughening chemically the surface of the adhesion assisting agent layer after any metal is chemically removed,
wherein the adhesion assisting agent layer comprises an adhesion assisting agent composition comprising (A) an epoxy resin, and the component (A) comprises a novolak epoxy resin and a rubber modified epoxy resin,
wherein the adhesion assisting agent composition further comprises (B) a polymer component which is able to be chemically roughened, (C) an epoxy resin curing agent, and (D) a curing accelerator, wherein 10 to 80% by weight of the component (A) is the rubber modified epoxy resin, and
wherein the component (B) is selected from the group consisting of acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber, carboxylic acid modified acrylonitrile butadiene rubber particles, particles having a butadiene rubber core and an acrylic resin shell, polyvinyl acetal resin, and carboxylic acid modified polyvinyl acetal resin, and the amount of the component (B) is from 0.5 to 25 parts by weight for 100 parts by weight of the component (A).
22. The adhesion assisting agent fitted metal foil according to claim 21 , wherein the component (C) is selected from the group consisting of a phenol novolak resin and a triazine-ring-containing phenol novolak resin.
23. The adhesion assisting agent fitted metal foil according to claim 21 , wherein the surface of the metal foil is not subjected to any roughening treatment for promoting adhesive force.
24. The adhesion assisting agent fitted metal foil according to claim 21 , wherein the metal foil is copper foil subjected to rust preventing treatment with at least one selected from the group consisting of nickel, tin, zinc, chromium, molybdenum, cobalt and oxide thereof.