Patent Assignment
Reel/Frame 019311/0942
Assignment of Assignor's Interest
Recorded: 2007-05-18
Pages: 4
Assignors
OGAWA, NOBUYUKI
Executed: 2007-04-27
ONOZEKI, HITOSHI
Executed: 2007-04-27
TANABE, TAKAHIRO
Executed: 2007-04-27
TAKAI, KENJI
Executed: 2007-04-27
MORIIKE, NORIO
Executed: 2007-04-27
TAKANEZAWA, SHIN
Executed: 2007-04-27
EJIRI, TAKAKO
Executed: 2007-04-27
KUMAKURA, TOSHIHISA
Executed: 2007-04-27
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Board Using Thereof
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →