Slurry and polishing method
A slurry containing abrasive grains and a liquid medium, the abrasive grains including first particles and second particles being in contact with the first particles, the first particles containing ceria, the first particles having a negative zeta potential, the second particles containing a hydroxide of a tetravalent metal element, and the second particles having a positive zeta potential.
1. A slurry comprising abrasive grains and a liquid medium,
the abrasive grains including first particles and second particles being in contact with the first particles,
the first particles containing ceria,
the first particles having a negative zeta potential,
the second particles containing a hydroxide of a tetravalent metal element, and
the second particles having a positive zeta potential.
2. The slurry according to claim 1 , wherein the hydroxide of a tetravalent metal element contains at least one selected from the group consisting of hydroxides of rare earth metal elements and hydroxide of zirconium.
3. The slurry according to claim 1 , wherein a zeta potential of the abrasive grains is +10 mV or higher.
4. The slurry according to any claim 1 , wherein a content of the abrasive grains is 0.01% to 10% by mass.
5. The slurry according to claim 1 , wherein the slurry is used for polishing a surface to be polished containing silicon oxide.
6. A polishing method comprising a step of polishing a surface to be polished using the slurry according to claim 1 .
7. The polishing method according to claim 6 , wherein the surface to be polished contains silicon oxide.