IP Library Assignment 057044/0555
Patent Assignment
Reel/Frame 057044/0555

Change of Name

Recorded: 2021-07-26 Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Slurry and Polishing Method
Application: 16/497,512 →
Publication: US 2021/0207002
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 18, 2019
From: IWANO, TOMOHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051318/0458 →
Assignment of Assignor's Interest Feb 24, 2020
From: IWANO, TOMOHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051904/0253 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →