Resin composition, and printed wiring board, laminated sheet, and prepreg using same
View Patent ↗There are provided a resin composition including: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; and (b) a silicone compound with at least one amino group per molecular structure and also provided a prepreg, a laminated plate, and a printed wiring board that are formed by using this resin composition. The multi-layered printed wiring board produced by using the laminated plate produced by laminating and molding the prepreg obtained from the resin composition of the present invention has excellent glass transition temperature, coefficient of thermal expansion, solder heat resistance, and warp characteristics. The multi-layered printed wiring board is useful as a highly integrated printed wiring board for an electronic device.
1. A resin composition comprising: (a) a maleimide compound with at least two N-substituted maleimide groups per molecular structure; (b) a silicone compound with at least one amino group per molecular structure; and (c) a compound with an amino group and a phenolic hydroxyl group per molecular structure.
2. The resin composition according to claim 1 further comprising (d) a thermosetting resin.
3. The resin composition according to claim 2 , wherein the compound (d) has an epoxy group and/or a cyanate group per molecular structure.
4. The resin composition according to claim 1 , wherein the silicone compound (b) has at least two amino groups per molecular structure.
5. The resin composition according to claim 1 , wherein the silicone compound (b) has an amino group at both ends.
6. The resin composition according to claim 1 , wherein the silicone compound (b) has an amino group at either end.
7. The resin composition according to claim 1 , wherein the silicone compound (b) has an amino group at a side chain.
8. The resin composition according to claim 1 , wherein the silicone compound (b) has an amino group at a side chain and at least one end.
9. The resin composition according to claim 1 further comprising (e) a curing accelerator represented by the following general formula (I) or (II),
wherein R 6 , R 7 , R 8 , and R 9 each independently represents a hydrogen atom, an aliphatic hydrocarbon group with 1-5 carbon atoms, or a phenyl group; and D is an alkylene group or an aromatic hydrocarbon group,
wherein R 6 , R 7 , R 8 , and R 9 each independently represents a hydrogen atom, an aliphatic hydrocarbon group with 1-5 carbon atoms, or a phenyl group; and B represents a single bond or any one of an alkylene group, an alkylidene group, an ether group, and a sulfonyl group.
10. The resin composition according to claim 1 further comprising (f) an inorganic filler.
11. A prepreg formed by using the resin composition according to claim 1 .
12. A laminated plate formed by using the prepreg according to claim 11 through laminated molding.
13. A printed wiring board produced by using the laminated plate according to claim 12 .
14. The resin composition according to claim 1 , wherein the compound with the amino group and the phenolic hydroxyl group per molecular structure is selected from the group consisting of m-aminophenol, p-aminophenol, o-aminophenol, p-aminobenzoic acid, m-aminobenzoic acid, and 3,5-dihydroxyaniline.
15. The resin composition according to claim 1 , wherein the compound with the amino group and the phenolic hydroxyl group per molecular structure is included in an amount of 1-50 parts by mass based on 100 parts by mass of said maleimide compound.
16. The resin composition according to claim 1 , wherein the compound with the amino group and the phenolic hydroxyl group per molecular structure is selected from the group consisting of m-aminophenol and p-aminophenol.
17. The resin composition according to claim 1 , wherein the compound with the amino group and the phenolic hydroxyl group per molecular structure is p-aminophenol.