Patent Assignment
Reel/Frame 031227/0688
Assignment of Assignor's Interest
Recorded: 2013-09-18
Pages: 3
Assignors
NAGAI, SHUNSUKE
Executed: 2013-08-22
MIYATAKE, MASATO
Executed: 2013-08-22
KOTAKE, TOMOHIKO
Executed: 2013-08-22
HASHIMOTO, SHINTARO
Executed: 2013-08-22
INOUE, YASUO
Executed: 2013-08-22
TAKANEZAWA, SHIN
Executed: 2013-08-22
MURAI, HIKARI
Executed: 2013-08-22
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 1630449, JAPAN
Covered Property
(1)
Resin Composition, and Printed Wiring Board, Laminated Sheet, and Prepreg Using Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →