IP Library Assignment 032111/0916
Patent Assignment
Reel/Frame 032111/0916

Change of Address

Recorded: 2014-01-22 Pages: 7
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2013-01-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing slurry and polishing method
Patent: 8,696,929 →
Application: 11/808,047 →
Publication: US 2008/0003924
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →