Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
View Patent ↗The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
1. A photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein
the composition comprises an (A) alkali-soluble polyimide resin obtained by reacting a tetracarboxylic acid dianhydride with a diamine containing 10 mol % to 80 mol % of a phenolic hydroxyl group-containing diamine represented by formula (A-1) based on the diamines in total and an aliphatic ether diamine represented by formula (8):
wherein R 1 , R 2 and R 3 are independently alkylene groups having 1 to 10 carbons atoms,
wherein in the above formulae b is an integer between 2 and 80, and
a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
2. The photosensitive adhesive composition according to claim 1 , wherein a Tg after exposure and further heat curing is not less than 80° C.
3. The photosensitive adhesive composition according to claim 1 , wherein a lowest melt viscosity at 20° C. to 200° C. after exposure is not more than 30000 Pa·s.
4. The photosensitive adhesive composition according to claim 1 , comprising a (B) radiation polymerizable compound, and a (C) photoinitiator.
5. The photosensitive adhesive composition according to claim 1 , wherein a Tg of the (A) alkali-soluble resin is 40° C. to 150° C.
6. The photosensitive adhesive composition according to claim 4 , wherein the (A) alkali-soluble resin is a polyimide resin having a carboxyl group and/or a hydroxyl group.
7. The photosensitive adhesive composition according to claim 1 , wherein the (B) radiation polymerizable compound contains at least one (meth)acrylate having a functionality of 3or more.
8. The photosensitive adhesive composition according to claim 4 , further comprising a (D) epoxy resin.
9. The photosensitive adhesive composition according to claim 8 , wherein the (D) epoxy resin contains at least one of a bisphenol F epoxy resin and a bisphenol A epoxy resin.
10. The photosensitive adhesive composition according to claim 4 , further comprising an (E) compound having an ethylenically unsaturated group and an epoxy group.
11. The photosensitive adhesive composition according to claim 4 , further comprising an (F) filler.
12. A film-like adhesive obtained by molding the photosensitive adhesive composition according to claim 1 into a film-like shape.
13. An adhesive sheet comprising a base material, and an adhesive layer formed on the base material and composed of the film-like adhesive according to claim 12 .
14. An adhesive pattern obtained by exposing an adhesive layer laminated on an adherent and composed of the film-like adhesive according to claim 12 , and performing a developing treatment on the adhesive layer after exposure with an alkali developer.
15. A semiconductor wafer with an adhesive layer comprising:
a semiconductor wafer; and
an adhesive layer laminated on the semiconductor wafer and composed of the film-like adhesive according to claim 12 .
16. A transparent substrate with an adhesive layer comprising:
a transparent substrate; and
an adhesive layer laminated on the transparent substrate and composed of the film-like adhesive according to claim 12 .
17. A semiconductor device having a structure in which using the photosensitive adhesive composition according to claim 1 , semiconductor elements are bonded to each other, and/or a structure in which using the photosensitive adhesive composition according to claim 1 , a semiconductor element and a semiconductor element-mounting support member are bonded to each other.
18. The semiconductor device according to claim 17 , wherein the semiconductor element-mounting support member is a transparent substrate.
19. The photosensitive adhesive composition according to claim 1 , wherein a Tg of the (A) alkali-soluble resin is at least 60° C.
20. The photosensitive adhesive composition according to claim 1 , further comprising a (B) radiation polymerizable compound containing at least one (meth)acrylate having a functionality of at least 2.
21. The photosensitive adhesive composition according to claim 1 , further comprising:
a (B) radiation polymerizable compound;
a (C) photoinitiator;
an (D) epoxy resin;
a curing agent; and
a (F) filler.
22. The photosensitive adhesive composition according to claim 1 , wherein the content of the diamine represented by formula (A-1) is 30 mol % to 70 mol % in total.
23. The photosensitive adhesive composition according to claim 1 , wherein the photosensitive adhesive composition has a property of airtight sealing.
24. The photosensitive adhesive composition according to claim 1 , wherein the photosensitive adhesive composition is configured to form an adhesive pattern on a transparent substrate of a solid-state imaging element.