Patent Assignment
Reel/Frame 028365/0788
Assignment of Assignor's Interest
Recorded: 2012-06-13
Pages: 2
Assignors
MITSUKURA, KAZUYUKI
Executed: 2012-05-29
KAWAMORI, TAKASHI
Executed: 2012-06-01
MASUKO, TAKASHI
Executed: 2012-06-01
KATOGI, SHIGEKI
Executed: 2012-06-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Photosensitive Adhesive Composition, Film-Like Adhesive, Adhesive Sheet, Adhesive Pattern, Semiconductor Wafer with Adhesive Layer, Semiconductor Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Mar 4, 2016
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 037999/0814 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →