IP Library Granted Patent US 11,649,869
Granted Patent B2
US 11,649,869 · App. 16/491,195 · Granted May 16, 2023

Friction material composition, friction material, and friction member

Inventors: Kazuya Baba (Tokyo, JP); Teruyuki Nagayoshi (Tokyo, JP); Yuichi Fukuzawa (Tokyo, JP)
Assignee: RESONAC CORPORATION
F16D69/026F16D65/04F16D2200/0039F16D2200/0065
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Quick Facts
Patent No.
US 11,649,869
App. No.
16/491,195
Granted
May 16, 2023
Kind
B2
Abstract

There are provided a friction material composition containing no copper or having a reduced content of copper that can provide a friction material in which the stability of the friction coefficient after standing in a cold environment, the abrasion resistance, and the low rust fixation properties are excellent, and squeal (particularly low temperature squeal) is suppressed, and a friction material obtained by molding the friction material composition, and a friction member using the friction material. The friction material composition is specifically a friction material composition comprising a bonding material, an organic filler, an inorganic filler, and a fiber substrate, in which the friction material composition comprises no copper, or has a content of copper of less than 0.5% by mass in terms of a copper element even if comprising the copper, and comprises, as the organic filler, cashew particles to which a silicone resin adheres.

Claims (8)

1. A friction material composition comprising an organic filler, an inorganic filler, a fiber substrate, and a bonding material, wherein the friction material composition comprises no copper, or has a content of copper of less than 0.5% by mass in terms of a copper element even if comprising the copper, the friction material composition comprises, as the organic filler, cashew particles to which a silicone resin adheres, and in the cashew particles to which the silicone resin adheres, an adhesion rate of the silicone resin is 29 to 45% by mass of the friction material composition.

2. The friction material composition according to claim 1 , wherein a content of the cashew particles to which the silicone resin adheres is 0.5 to 15 parts by mass based on 100 parts by mass of the friction material composition.

3. The friction material composition according to claim 1 , comprising no copper.

4. The friction material composition according to claim 3 , wherein a content of the cashew particles to which the silicone resin adheres is 3 to 9% by mass of the friction material composition.

5. A friction material obtained by molding the friction material composition according to claim 1 .

6. A friction member wherein the friction material according to claim 5 is disposed on a back metal.

7. A friction member wherein the friction material according to claim 5 is disposed on a back metal via an intermediate layer.

8. The friction material composition according to claim 1 , wherein a content of the cashew particles to which the silicone resin adheres is 3 to 9% by mass of the friction material composition.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2019
From: BABA, KAZUYA; NAGAYOSHI, TERUYUKI; FUKUZAWA, YUICHI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 050278/0405 →
Continuity (1)
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