Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.
1. A photosensitive resin composition, comprising:
a binder polymer resulting from the copolymerization of a (meth)acrylic acid, a styrene or α-methylstyrene, a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a benzyl (meth)acrylate;
a photopolymerizable compound including a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 2 to 7 structural units of a propyleneoxy group; and
a photopolymerization initiator,
wherein a content of the bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 2 to 7 structural units of a propyleneoxy group, in the photosensitive resin composition is from 10 parts by mass to 50 parts by mass, with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.
2. A photosensitive element, comprising:
a support; and
a photosensitive resin composition layer that is provided on the support and that is formed from the photosensitive resin composition according to claim 1 .
3. A method for forming a resist pattern, the method comprising:
forming a photosensitive resin composition layer on a substrate using the photosensitive resin composition according to claim 1 ;
irradiating at least a part of an area of the photosensitive resin composition layer with active light rays and photo-curing the area to form a cured material area; and
removing an area other than the cured material area of the photosensitive resin composition layer from the substrate to form a resist pattern, which is the cured material area, on the substrate.
4. The method for forming a resist pattern according to claim 3 , wherein the active light rays have a wavelength in a range of from 340 nm to 430 nm.
5. A method for producing a printed wiring board, the method comprising:
subjecting the substrate, on which the resist pattern has been formed using the method for forming a resist pattern according to claim 3 , to at least one of etching or plating.
6. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound has from 3 to 7 structural units of a propyleneoxy group.
7. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound has from 2 to 5 structural units of a propyleneoxy group.
8. The photosensitive resin composition according to claim 1 , wherein the photopolymerizable compound has from 3 to 5 structural units of a propyleneoxy group.
9. The photosensitive resin composition according to claim 1 , wherein the binder polymer results from the copolymerization of a (meth)acrylic acid, a styrene or α-methylstyrene, a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, a benzyl (meth)acrylate, and a structural unit derived from an alkyl (meth)acrylate ester.
10. The photosensitive resin composition according to claim 1 , wherein the binder polymer comprises methacrylic acid, styrene, 2-hydroxyethyl methacrylate, benzyl methacrylate and methyl methacrylate or butyl methacrylate.