Patent Assignment
Reel/Frame 039002/0007
Assignment of Assignor's Interest
Recorded: 2016-06-24
Pages: 4
Assignors
OKADE, SHOTA
Executed: 2016-06-13
MIYASAKA, MASAHIRO
Executed: 2016-06-13
MURAMATSU, YUKIKO
Executed: 2016-06-13
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →