IP Library Granted Patent US 9,052,587
Granted Patent B2
US 9,052,587 · App. 13/881,854 · Granted Jun 9, 2015

Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

Inventors: Hiroshi Yamazaki (Hitachi, JP); Yoshimi Igarashi (Hitachi, JP)
Assignee: Hitachi Chemical Company, Ltd.
G03F7/0005H05K3/06G03F7/027G03F7/092G03F7/095G03F7/0952G03F7/0955G03F7/2022
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Quick Facts
Patent No.
US 9,052,587
App. No.
13/881,854
Granted
Jun 9, 2015
Kind
B2
Abstract

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Claims (27)

1. A conductive pattern formation method comprising:

a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate;

a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and

a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

2. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate.

3. The conductive pattern formation method according to claim 2 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with the support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed.

4. The conductive pattern formation method according to claim 1 , wherein the conductive film contains an organic conductive material.

5. The conductive pattern formation method according to claim 1 , wherein the conductive film contains conductive fiber.

6. The conductive pattern formation method according to claim 5 , wherein the conductive fiber is silver fiber.

7. The conductive pattern formation method according to claim 1 , wherein the conductive film contains at least one type of conductive material selected from the group consisting of polythiophene, a polythiophene derivative, polyaniline, and a polyaniline derivative.

8. The conductive pattern formation method according to claim 1 , wherein the photosensitive resin layer contains a binder polymer, a photopolymerizable compound including ethylenically unsaturated bonds, and a photopolymerization initiator.

9. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, and wherein the conductive film contains an organic conductive material.

10. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, and wherein the conductive film contains an organic conductive material.

11. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, and wherein the conductive film contains conductive fiber.

12. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, and wherein the conductive film contains conductive fiber.

13. The conductive pattern formation method according to claim 1 , wherein the conductive film contains at least one type of conductive material selected from the group consisting of inorganic conductive materials and organic conductive materials, and wherein the conductive film contains conductive fiber.

14. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, wherein the conductive film contains at least one type of conductive material selected from the group consisting of inorganic conductive materials and organic conductive materials, and wherein the conductive film contains conductive fiber.

15. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, wherein the conductive film contains at least one type of conductive material selected from the group consisting of inorganic conductive materials and organic conductive materials, and wherein the conductive film contains conductive fiber.

16. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

17. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

18. The conductive pattern formation method according to claim 1 , wherein the conductive film contains an organic conductive material, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

19. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, wherein the conductive film contains at least one type of conductive material selected from the group consisting of inorganic conductive materials and organic conductive materials, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

20. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, wherein the conductive film contains at least one type of conductive material selected from the group consisting of inorganic conductive materials and organic conductive materials, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

21. The conductive pattern formation method according to claim 1 , wherein the conductive film contains an inorganic conductive material.

22. The conductive pattern formation method according to claim 1 , wherein the photosensitive layer is provided by laminating a photosensitive conductive film including a support film, the conductive film provided on the support film, and the photosensitive resin layer provided on the conductive film, so that the photosensitive resin layer abuts the substrate, and wherein the conductive film contains an inorganic conductive material.

23. The conductive pattern formation method according to claim 1 , wherein the first exposure step is a step of radiating active light to the photosensitive layer with a support film, and the second exposure step is a step of radiating active light to the photosensitive layer wherefrom the support film is removed, and wherein the conductive film contains an inorganic conductive material.

24. The conductive pattern formation method according to claim 1 , wherein the conductive film contains an inorganic conductive material, and wherein the conductive film contains conductive fiber, the conductive fiber being silver fiber.

Assignments (4)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF ADDRESS Recorded Apr 28, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 035509/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2013
From: YAMAZAKI, HIROSHI; IGARASHI, YOSHIMI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 030876/0585 →
Priority Claims (1)
JP P2011-219176 · Oct 3, 2011 · national
Continuity (1)
Related Publication 20140327889A1 · Nov 6, 2014