Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate
View Patent ↗A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and an aliphatic compound having two or more functional groups, the functional groups being at least one functional group selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group, wherein the photosensitive acid generator is a sulfonium salt containing an anion having at least one skeleton selected from the group consisting of a tetraphenylborate skeleton, an alkylsulfonate skeleton having 1 to 20 carbon atoms, a phenylsulfonate skeleton and a 10-camphorsulfonate skeleton.
1. A photosensitive resin composition comprising:
a component (A): a resin having a phenolic hydroxyl group;
a component (B): a photosensitive acid generator;
a component (C): a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; and
a component (D): an aliphatic compound having two or more functional groups, each of the two or more functional groups being the same or different and being selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group,
wherein the component (B) is a sulfonium salt containing an anion having a substituted or unsubstituted tetraphenylborate skeleton.
2. The photosensitive resin composition according to claim 1 , wherein the anion of the component (B) is tetrakis(pentafluorophenyl)borate.
3. The photosensitive resin composition according to claim 1 , wherein a content of the component (D) is 1 to 70 parts by mass with respect to 100 parts by mass of the component (A).
4. The photosensitive resin composition according to claim 1 , further comprising a compound having a Si—O bond.
5. A photosensitive element comprising:
a support; and
a photosensitive layer provided on the support,
wherein the photosensitive layer comprises the photosensitive resin composition according to claim 1 .
6. A method for forming a resist pattern, comprising:
a step of disposing the photosensitive layer of the photosensitive element according to claim 5 on a substrate;
an exposing step of exposing the photosensitive layer in order to form a predetermined pattern;
a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and
a heat-treating step of heat-treating the resin pattern.
7. A cured product of the photosensitive resin composition according to claim 1 .
8. A semiconductor device comprising the cured product of the photosensitive resin composition according to claim 7 .
9. A method for forming a resist pattern, comprising:
a step of forming a photosensitive layer comprising the photosensitive resin composition according to claim 1 on a substrate;
an exposing step of exposing the photosensitive layer in order to form a predetermined pattern;
a developing step of developing the photosensitive layer after the exposing step to obtain a resin pattern; and
a heat-treating step of heat-treating the resin pattern.
10. The method for forming a resist pattern according to claim 9 , further comprising a step of heat-treating the photosensitive layer between the exposing step and the developing step.
11. A method for producing a circuit substrate, comprising:
a conductor layer forming step of subjecting at least a part of an exposed part of the resin pattern after the heat-treating step in the method for forming a resist pattern according to claim 9 , and at least a part of an exposed part of the substrate to a plating treatment, to form a conductor layer; and
a conductor pattern forming step of removing a part of the conductor layer to form a conductor pattern,
wherein the circuit substrate includes a resin pattern and a conductor pattern.
12. The method for producing a circuit substrate according to claim 11 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing electroless plating, to form the conductor layer.
13. The method for producing a circuit substrate according to claim 11 , wherein the conductor layer forming step includes a step of performing electrolytic plating after performing sputtering, to form the conductor layer.
14. The method for producing a circuit substrate according to claim 11 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by etching, to form the conductor pattern.
15. The method for producing a circuit substrate according to claim 11 , wherein the conductor pattern forming step includes a step of removing a part of the conductor layer by polishing, to form the conductor pattern.
16. The photosensitive resin composition according to claim 1 , wherein the component (C) is 1,3,4,6-tetrakis(methoxymethyl)glycoluril.
17. The photosensitive resin composition according to claim 1 , wherein the component (D) is trimethylolpropane triglycidyl ether.
18. The photosensitive resin composition according to claim 1 , wherein the component (D) is pentaerythritol triacrylate.
19. The photosensitive resin composition according to claim 1 , wherein, the component (D) has at least one each of two or more categories of different functional groups, the categories of different functional groups being selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group.
20. The photosensitive resin composition according to claim 1 , wherein, the component (D) has two or more of one functional group category selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group.