Patent Assignment
Reel/Frame 042510/0383
Assignment of Assignor's Interest
Recorded: 2017-05-25
Pages: 3
Assignors
KATO, TETSUYA
Executed: 2017-04-04
IWASHITA, KENICHI
Executed: 2017-04-04
NAKAMURA, AKIHIRO
Executed: 2017-04-04
ONO, HIROSHI
Executed: 2017-04-05
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Photosensitive Element, Cured Product, Semiconductor Device, Method for Forming Resist Pattern, and Method for Producing Circuit Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →