IP Library Granted Patent US 9,817,499
Granted Patent B2
US 9,817,499 · App. 15/144,850 · Granted Nov 14, 2017

Conductive pattern formation method, conductive pattern-bearing substrate, and touch panel sensor

Inventors: Hiroshi Yamazaki (Hitachi, JP); Yoshimi Igarashi (Hitachi, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
G06F3/041G03F7/0005G03F7/027G03F7/09G03F7/092G03F7/095G03F7/0952G03F7/0955G03F7/2022G06F3/044H05K1/0274H05K1/036H05K1/0313H05K1/09H05K3/06G06F2203/04112H05K2201/0275Y10T428/24802
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Quick Facts
Patent No.
US 9,817,499
App. No.
15/144,850
Granted
Nov 14, 2017
Kind
B2
Abstract

A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Claims (19)

1. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film,

wherein the conductive film comprises at least one of an organic conductive material and conductive fiber.

2. The conductive film substrate according to claim 1 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 1 μm or less.

3. The conductive film substrate according to claim 1 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 0.7 μm or less.

4. The conductive film substrate according to claim 1 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 0.5 μm or less.

5. The conductive film substrate according to claim 1 , wherein the conductive film comprises conductive fiber.

6. The conductive film substrate according to claim 1 , wherein the conductive film comprises silver fiber.

7. A touch panel sensor comprising the conductive film substrate according to claim 1 .

8. A conductive film substrate comprising:

a. a substrate; and

b. a cured resin layer on the substrate, the cured resin layer comprising a first surface opposite the substrate, the first surface having a portion including a conductive film and a portion without a conductive film, wherein the conductive film comprises conductive fiber, and

wherein a minimum optical transmittance of the conductive film substrate in a wavelength band of 450 to 650 nm is 80% or higher.

9. The conductive film substrate according to claim 8 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 1 μm or less.

10. The conductive film substrate according to claim 8 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 0.7 μm or less.

11. The conductive film substrate according to claim 8 , wherein a step difference Ha between a surface of the conductive film opposite the substrate and the portion without the conductive film is 0.5 μm or less.

12. The conductive film substrate according to claim 8 , wherein the conductive fiber comprises silver fiber.

13. A touch panel sensor comprising the conductive film substrate according to claim 8 .

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2017
From: YAMAZAKI, HIROSHI; IGARASHI, YOSHIMI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 043793/0242 →
Priority Claims (1)
JP 2011-219176 · Oct 3, 2011 · national
Continuity (3)
Continuation 14732817 · Jun 8, 2015
Division 13881854
Related Publication 20160246394A1 · Aug 25, 2016