IP Library Granted Patent US 10,353,293
Granted Patent B2
US 10,353,293 · App. 15/026,764 · Granted Jul 16, 2019

Photosensitive conductive film, conductive pattern formation method using same, and conductive pattern substrate

Inventors: Masahiko Ebihara (Tokyo, JP); Emiko Oota (Tokyo, JP); Yasuharu Murakami (Tokyo, JP); Hiroshi Yamazaki (Tokyo, JP); Hiroyuki Tanaka (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
G03F7/32B32B3/08B32B5/02B32B27/12B32B27/20B32B27/30G03F7/0047G03F7/033G03F7/16G03F7/20G03F7/343B32B2262/103B32B2264/10B32B2264/107B32B2457/00B32B2457/202
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Quick Facts
Patent No.
US 10,353,293
App. No.
15/026,764
Granted
Jul 16, 2019
Kind
B2
Abstract

The conductive pattern formation method according to the present invention comprises a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material, and a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern.

Claims (18)

1. A conductive pattern formation method, comprising:

a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, wherein an average primary particle size of the inorganic filler is 200 nm or less, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material; and

a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern on the base material.

2. The conductive pattern formation method according to claim 1 , wherein the inorganic filler contains an inorganic filler having a primary particle size of 1 to 1000 nm.

3. The conductive pattern formation method according to claim 1 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.

4. The conductive pattern formation method according to claim 3 , wherein the binder polymer has a carboxyl group.

5. The conductive pattern formation method according to claim 1 , wherein a laminate of the conductive layer and the photosensitive resin layer has a minimum light transmittance of 80% or more in the wavelength band of 450 to 650 nm.

6. The conductive pattern formation method according to claim 1 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

7. A conductive pattern formation method, comprising:

providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, wherein an average primary particle size of the inorganic filler is 200 nm or less, and a support film in this order;

laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer is in direct contact with the base material; and

exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern on the base material.

8. (Withdrawn and Currently Amended)The conductive pattern formation method according to claim 7 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

9. The conductive pattern formation method according to claim 7 , wherein the inorganic filler contains an inorganic filler having a primary particle size of 1 to 1000 nm.

10. The conductive pattern formation method according to claim 9 , wherein the conductive pattern comprises the conductive layer including conductive fibers disposed on the base material and a cured portion of the photosensitive resin layer disposed on the conductive layer.

11. The conductive pattern formation method according to claim 7 , wherein the photosensitive resin layer comprises a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator.

12. The conductive pattern formation method according to claim 11 , wherein the binder polymer has a carboxyl group.

13. The conductive pattern formation method according to claim 7 , wherein a laminate of the conductive layer and the photosensitive resin layer has a minimum light transmittance of 80% or more in the wavelength band of 450 to 650 nm.

Assignments (3)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2016
From: EBIHARA, MASAHIKO; OOTA, EMIKO; MURAKAMI, YASUHARU; YAMAZAKI, HIROSHI; TANAKA, HIROYUKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 039499/0786 →
Priority Claims (1)
JP 2013-208059 · Oct 3, 2013 · national
Continuity (1)
Related Publication 20160238942A1 · Aug 18, 2016
Cited By (1)
US 12,341,145