Composition of polycyanate ester and biphenyl epoxy resin

1. A resin composition for printed wiring board which comprises a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a monovalent phenol compound, and which further comprises a polyphenylene ether resin, wherein the epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule is contained in an amount of 10 to 250 parts by weight based on 100 parts by weight of the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof.

2. A resin composition for printed wiring board which comprises a phenol-modified cyanate ester oligomer obtained by reacting a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, a monovalent phenol compound, then mixing an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and which further comprises a poly-phenylene ether resin.

3. A resin composition for printed wiring board which comprises an epoxy/phenol-modified cyanate ester oligomer obtained by reacting a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and a monovalent phenol compound, and wherein the composition further comprises a polyphenylene ether resin.

4. A resin composition for printed wiring board which comprises an epoxy/phenol-modified cyanate ester oligomer obtained by reacting a cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, a monovalent phenol compound and an epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule in the presence of a polyphenylene ether resin.

5. The resin composition for printed wiring board according to claim 1 , wherein the monovalent phenol compound is contained in an amount of 2 to 60 parts by weight based on 100 parts by weight of the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof.

6. The resin composition for printed wiring board according to claim 1 , wherein the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof is at least one selected from the group consisting of a cyanate ester compound represented by the formula (I):

wherein R 1 represents

or

R 2 and R 3 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and each is the same or different from each other,

and a cyanate ester compound represented by the formula (II):

wherein R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m represents an integer of 1 to 7,

and a prepolymer thereof.

7. The resin composition for printed wiring board according to claim 1 , wherein the epoxy resin having a biphenyl structure in the molecule in the epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule is at least one selected from the group consisting of an epoxy resin represented by the formula (III):

wherein R 5 each represent a hydrogen atom or a methyl group, n represents an integer of 0 to 6,

and an epoxy resin represented by the formula (IV):

wherein p represents an integer of 1 to 5.

8. The resin composition for printed wiring board according to claim 1 , wherein the composition further comprises, as a flame retardant, at least one selected from the group consisting of 1,2-dibromo-4-(1,2-dibromoethyl)cyclohexane, tetrabromocyclooctane, hexabromocyclododecane, bis(tribromophenoxy)ethane, a brominated triphenylcyanurate represented by the formula (VII):

wherein s, t and u each represent an integer of 1 to 5, and each is the same value or different from each other,

a brominated polyphenylene ether and a brominated polystyrene.

9. The resin composition for printed wiring board according to claim 1 , which further comprises an antioxidant.

10. A resin varnish for a printed wiring board obtained by dissolving or dispersing the resin composition for printed wiring board according to claim 1 in a solvent.

11. The resin composition for printed wiring board according to claim 2 , wherein the phenol-modified cyanate ester oligomer is a phenol-modified cyanate ester oligomer obtained by reacting 100 parts by weight of the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, and 2 to 60 parts by weight of the monovalent phenol compound, and the epoxy resin compound containing at least one kind of an epoxy resin having a biphenyl structure in the molecule is contained in an amount of 10 to 250 parts by weight.

12. The resin composition for printed wiring board according to claim 2 , wherein the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof is at least one selected from the group consisting of a cyanate ester compound represented by the formula (I):

wherein R 1 represents

or

R 2 and R 3 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and each is the same or different from each other,

and a cyanate ester compound represented by the formula (II):

wherein R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m represents an integer of 1 to 7,

and a prepolymer thereof.

13. The resin composition for printed wiring board according to claim 2 , wherein the epoxy resin having a biphenyl structure in the molecule in the epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule is at least one selected from the group consisting of an epoxy resin represented by the formula (III):

wherein R 5 each represent a hydrogen atom or a methyl group, n represents an integer of 0 to 6,

and an epoxy resin represented by the formula (IV):

wherein p represents an integer of 1 to 5.

14. The resin composition for printed wiring board according to claim 2 , wherein the composition further comprises at least one selected from the group consisting of 1,2-dibromo-4-(1,2-dibromoethyl)cyclohexane, tetrabromocyclooctane, hexabromocyclododecane, bis(tribromophenoxy)ethane, a brominated triphenylcyanurate represented by the formula (VII):

wherein s, t and u each represent an integer of 1 to 5, and each is the same value or different from each other,

a brominated polyphenylene ether and a brominated polystyrene, as a flame retardant.

15. The resin composition for printed wiring board according to claim 2 , which further comprises an antioxidant.

16. A resin varnish for a printed wiring board obtained by dissolving or dispersing the resin composition for printed wiring board according to claim 2 in a solvent.

17. The resin composition for printed wiring board according to claim 3 , wherein the epoxy/phenol-modified cyanate ester oligomer is an epoxy/phenol-modified cyanate ester oligomer obtained by reacting 100 parts by weight of the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof, 10 to 250 parts by weight of the epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule, and 2 to 60 parts by weight of the monovalent phenol compound.

18. The resin composition for printed wiring board according to claim 3 , wherein the cyanate ester compound having 2 or more cyanate groups in the molecule and/or a prepolymer thereof is at least one selected from the group consisting of a cyanate ester compound represented by the formula (I):

wherein R 1 represents

or

R 2 and R 3 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and each is the same or different from each other,

and a cyanate ester compound represented by the formula (II):

wherein R 4 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m represents an integer of 1 to 7,

and a prepolymer thereof.

19. The resin composition for printed wiring board according to claim 3 , wherein the epoxy resin having a biphenyl structure in the molecule in the epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure in the molecule is at least one selected from the group consisting of an epoxy resin represented by the formula (III):

wherein R 5 each represent a hydrogen atom or a methyl group, n represents an integer of 0 to 6,

and an epoxy resin represented by the formula (IV):

wherein p represents an integer of 1 to 5.

20. The resin composition for printed wiring board according to claim 3 , wherein the composition further comprises at least one selected from the group consisting of 1,2-dibromo-4-(1,2-dibromoethyl)cyclohexane, tetrabromocyclooctane, hexabromocyclododecane, bis(tribromophenoxy)ethane, a brominated triphenylcyanurate represented by the formula (VII):

wherein s, t and u each represent an integer of 1 to 5, and each is the same value or different from each other,

a brominated polyphenylene ether and a brominated polystyrene, as a flame retardant.

21. The resin composition for printed wiring board according to claim 3 , which further comprises an antioxidant.

22. A resin varnish for a printed wiring board obtained by dissolving or dispersing the resin composition for printed wiring board according to claim 3 in a solvent.

23. A resin varnish for a printed wiring board obtained by dissolving or dispersing the resin composition for printed wiring board according to claim 4 in a solvent.

24. The resin composition for printed wiring board according to claim 1 , wherein said epoxy resin having a biphenyl structure in the molecule is a biphenyl epoxy resin.

25. The resin composition for printed wiring board according to claim 1 , wherein said epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure is contained in an amount of 10 to 150 parts by weight based on 100 parts by weight of the cyanate ester having 2 or more cyanate groups in the molecule and/or a prepolymer thereof.

26. The resin composition for printed wiring board according to claim 1 , wherein said epoxy resin containing at least one kind of an epoxy resin having a biphenyl structure is contained in an amount of 10 to 100 parts by weight based on 100 parts by weight of the cyanate ester having 2 or more cyanate groups in the molecule and/or a prepolymer thereof.

27. The resin composition for printed wiring board according to claim 1 , wherein an amount of said at least one kind of an epoxy resin having a biphenyl structure is at least 50% by weight of a total weight of said epoxy resin in the resin composition.

28. The resin composition for printed wiring board according to claim 1 , wherein an amount of said at least one kind of an epoxy resin having a biphenyl structure is at least 70% by weight of a total weight of said epoxy resin in the resin composition.

29. The resin composition for printed wiring board according to claim 1 , wherein an amount of said at least one kind of an epoxy resin having a biphenyl structure is 100% by weight of a total weight of said epoxy resin in the resin composition.