IP Library Granted Patent US 8,426,741
Granted Patent B2
US 8,426,741 · App. 13/046,544 · Granted Apr 23, 2013

Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate

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Quick Facts
Patent No.
US 8,426,741
App. No.
13/046,544
Granted
Apr 23, 2013
Kind
B2
Abstract

A photosensitive conductive film 10 according to the invention includes a support film 1 , a conductive layer 2 containing conductive fiber formed on the support film 1 , and a photosensitive resin layer 3 formed on the conductive layer 2.

Claims (29)

1. A photosensitive conductive film comprising a support film, a conductive layer containing conductive fiber formed on the support film, and a photosensitive resin layer formed on the conductive layer,

wherein the photosensitive resin layer comprises a binder polymer having a carboxyl group, a photopolymerizable compound having an ethylenic unsaturated bond, and a photopolymerization initiator.

2. The photosensitive conductive film according to claim 1 , wherein a minimum light transmittance in a wavelength range of 450 to 650 nm of a laminate of the conductive layer and the photosensitive resin layer is 80% or higher, provided that a total film thickness of the two layers is set at 1 to 10 μm.

3. The photosensitive conductive film according to claim 1 , wherein the conductive fiber is silver fiber.

4. The photosensitive conductive film according to claim 1 , wherein the conductive fiber is at least one selected from a group consisting of metal fiber and carbon fiber.

5. The photosensitive conductive film according to claim 1 , wherein the conductive fiber is at least one selected from a group consisting of gold fiber, silver fiber, platinum fiber and carbon nanotube.

6. The photosensitive conductive film according to claim 1 , wherein a fiber diameter of the conductive fiber is 1 nm to 50 nm.

7. The photosensitive conductive film according to claim 1 , wherein the binder polymer includes an acrylic resin.

8. The photosensitive conductive film according to claim 7 , wherein the acrylic resin has as constituent units monomer units derived from (meth)acrylic acid and a (meth)acrylic acid alkyl ester.

9. The photosensitive conductive film according to claim 1 , wherein the content of a carboxyl group contained in the binder polymer in terms of the ratio of a polymerizable monomer having a carboxyl group to the total polymerizable monomers used, is 12 to 50% by mass.

10. The photosensitive conductive film according to claim 1 , wherein the support film is made of a material selected from the group consisting of polyethylene terephthalate, polyethylene, polypropylene and a polycarbonate.

11. The photosensitive conductive film according to claim 1 , further comprising a protection film contacting a surface of the photosensitive resin layer opposite the surface thereof facing the support film.

12. A method for forming a conductive film, comprising:

a lamination step of laminating the photosensitive conductive film according to claim 1 so that the photosensitive resin layer is tightly attached onto a substrate; and

an exposure step of irradiating a predetermined part of the photosensitive resin layer on the substrate with actinic light.

13. A conductive film substrate comprising a substrate and a conductive film formed on the substrate by the method for forming a conductive film according to claim 12 .

14. The conductive film substrate according to claim 13 , wherein a surface resistivity of the conductive film is 2000 Ω/square or less.

15. A method for forming a conductive film, comprising:

obtaining a photosensitive conductive film by coating onto a support film a conductive fiber dispersion liquid containing conductive fiber and at least one of water and an organic solvent followed by drying, and then by coating thereon a photosensitive resin composition solution followed by drying;

laminating the photosensitive conductive film so that a surface of said photosensitive conductive film opposite to said support film is tightly attached onto a substrate; and

exposing the laminated photosensitive conductive film by irradiating the laminated photosensitive conductive film with an active light ray.

16. The method for forming a conductive film according to claim 15 , wherein said substrate is a glass substrate or a plastic substrate.

17. A method for forming a conductive pattern, comprising:

obtaining a photosensitive conductive film by coating onto a support film a conductive fiber dispersion liquid containing conductive fiber and at least one of water and an organic solvent followed by drying, and then by coating thereon a photosensitive resin composition solution followed by drying;

laminating the photosensitive conductive film so that a surface of said photosensitive conductive film opposite to said support film is tightly attached onto a substrate;

irradiating the laminated photosensitive conductive film with an active light ray; and

then, developing the exposed laminated photosensitive conductive film to form a conductive pattern.

18. The method for forming a conductive pattern according to claim 17 , wherein said developing is performed using an alkaline aqueous solution.

19. The method for forming a conductive pattern according to claim 18 , wherein said alkaline aqueous solution has a pH in a range of 9 to 11.

Assignments (2)
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →