CMP polishing solution and polishing method
View Patent ↗The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film.
1. A polishing method comprising
a first polishing step of polishing a conductive substance layer of a substrate comprising an interlayer insulating film having an elevated section and a trench at a surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, to expose the barrier layer located on the elevated section of the interlayer insulating film,
a step of preparing a CMP polishing slurry comprising (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a zeta potential of +6 mV to +30 mV in the CMP polishing slurry, (C) a metal oxide solubilizer and (D) an oxidizing agent, and
a second polishing step of polishing the barrier layer exposed in the first polishing step using the CMP polishing slurry to expose the elevated section of the interlayer insulating film,
wherein (B) the abrasive grain comprises colloidal silica, and
at least the barrier layer and the interlayer insulating film are polished to remove a portion of the barrier layer and a portion of the interlayer insulating film after the elevated section of the interlayer insulating film is exposed.
2. The method according to claim 1 , wherein the interlayer insulating film is at least one film selected from among silicon-based coating films and organic polymer films.
3. The method according to claim 1 , wherein the conductive substance layer comprises at least one compound selected from among copper, copper alloys, copper oxides and copper alloy oxides.
4. The method according to claim 1 , wherein the barrier layer comprises at least one compound selected from among tungsten compounds, tantalum compounds, titanium compounds, ruthenium compounds and cobalt compounds.
5. The method according to claim 1 , wherein the barrier layer comprises a tantalum compound.
6. The method according to claim 1 , wherein the component (A) is at least one compound selected from among 1-acetyl-1H-1,2,3-triazolo[4,5-b]pyridine, 1H-1,2,3-triazolo[4,5-b]pyridine and 3H-1,2,3-triazolo[4,5-b]pyridine-3-ol.
7. The method according to claim 1 , wherein the component (A) is at least one compound selected from among 1-acetyl-1H-1,2,3-triazolo[4,5-b]pyridine and 1H-1,2,3-triazolo[4,5-b]pyridine.
8. The method according to claim 1 , wherein a content of the component (A) is 0.001-10 parts by mass with respect to 100 parts by mass of the CMP polishing slurry.
9. The method according to claim 1 , wherein the component (C) is at least one compound selected from among organic acids, organic acid esters, organic acid ammonium salts, inorganic acids and inorganic acid ammonium salts.
10. The method according to claim 1 , wherein the component (D) is at least one compound selected from among hydrogen peroxide, periodic acid salts, persulfuric acid salts, hypochlorous acid salts and ozone water.
11. The method according to claim 1 , wherein the CMP polishing slurry further comprises (E) a water-soluble polymer.
12. The method according to claim 11 , wherein the component (E) is at least one compound selected from among polycarboxylic acids, polycarboxylic acid salts, polycarboxylic acid esters, polysaccharides and vinyl-based polymers.
13. The method according to claim 1 , wherein the CMP polishing slurry further comprises (F) an organic solvent.
14. The method according to claim 13 , wherein the component (F) is at least one compound selected from among carbonic acid esters, lactones, glycols and glycol derivatives, ethers, alcohols, ketones, phenols, amides and sulfolanes.
15. The method according to claim 13 , wherein the component (F) is at least one compound selected from among carbonic acid esters, lactones, glycols and glycol derivatives, ethers, ketones, phenols, amides, n-methylpyrrolidone, ethyl lactate, and sulfolanes.
16. The method according to claim 1 , wherein no deposition of a reaction product is observed after removing the component (B) from the CMP polishing slurry and adding water in a corresponding mass to prepare a measuring solution, adding 0.5 parts by mass of copper (II) sulfate with respect to 100 parts by mass of the measuring solution to obtain a mixture, stirring the mixture, and standing for 1 day.
17. The method according to claim 1 , wherein (B) the abrasive grain has a zeta potential of +6 mV to +21 mV in the CMP polishing slurry.
18. A polishing method comprising
a step of preparing a substrate comprising an interlayer insulating film and a barrier layer,
a step of preparing a CMP polishing slurry comprising (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a zeta potential of +6 mV to +30 mV in the CMP polishing slurry, (C) a metal oxide solubilizer and (D) an oxidizing agent, and
a polishing step of polishing at least the barrier layer and the interlayer insulating film using the CMP polishing slurry to remove a portion of the barrier layer and a portion of the interlayer insulating film,
wherein (B) the abrasive grain comprises colloidal silica.
19. The method according to claim 18 , wherein at least a portion of the interlayer insulating film is removed in the polishing step.
20. The method according to claim 18 , wherein the substrate further comprises a conductive substance layer, and
at least a portion of the conductive substance layer is removed in the polishing step.
21. The method according to claim 20 , wherein the conductive substance layer comprises at least one compound selected from among copper, copper alloys, copper oxides and copper alloy oxides.
22. The method according to claim 18 , wherein the interlayer insulating film is at least one film selected from among silicon-based coating films and organic polymer films.
23. The method according to claim 18 , wherein the barrier layer comprises at least one compound selected from among tungsten compounds, tantalum compounds, titanium compounds, ruthenium compounds and cobalt compounds.
24. The method according to claim 18 , wherein the barrier layer comprises a tantalum compound.
25. The method according to claim 18 , wherein the component (A) is at least one compound selected from among 1-acetyl-1H-1,2,3-triazolo[4,5-b]pyridine, 1H-1,2,3-triazolo[4,5-b]pyridine and 3H-1,2,3-triazolo[4,5-b]pyridine-3-ol.
26. The method according to claim 18 , wherein the component (A) is at least one compound selected from among 1-acetyl-1H-1,2,3-triazolo[4,5-b]pyridine and 1H-1,2,3-triazolo[4,5-b]pyridine.
27. The method according to claim 18 , wherein a content of the component (A) is 0.001-10 parts by mass with respect to 100 parts by mass of the CMP polishing slurry.
28. The method according to claim 18 , wherein the component (C) is at least one compound selected from among organic acids, organic acid esters, organic acid ammonium salts, inorganic acids and inorganic acid ammonium salts.
29. The method according to claim 18 , wherein the component (D) is at least one compound selected from among hydrogen peroxide, periodic acid salts, persulfuric acid salts, hypochlorous acid salts and ozone water.
30. The method according to claim 18 , wherein the CMP polishing slurry further comprises (E) a water-soluble polymer.
31. The method according to claim 30 , wherein the component (E) is at least one compound selected from among polycarboxylic acids, polycarboxylic acid salts, polycarboxylic acid esters, polysaccharides and vinyl-based polymers.
32. The method according to claim 18 , wherein the CMP polishing slurry further comprises (F) an organic solvent.
33. The method according to claim 32 , wherein the component (F) is at least one compound selected from among carbonic acid esters, lactones, glycols and glycol derivatives, ethers, alcohols, ketones, phenols, amides and sulfolanes.
34. The method according to claim 32 , wherein the component (F) is at least one compound selected from among carbonic acid esters, lactones, glycols and glycol derivatives, ethers, ketones, phenols, amides, n-methylpyrrolidone, ethyl lactate, and sulfolanes.
35. The method according to claim 18 , wherein no deposition of a reaction product is observed after removing the component (B) from the CMP polishing slurry and adding water in a corresponding mass to prepare a measuring solution, adding 0.5 part by mass of copper (II) sulfate with respect to 100 parts by mass of the measuring solution to obtain a mixture, stirring the mixture, and standing for 1 day.
36. The method according to claim 18 , wherein (B) the abrasive grain has a zeta potential of +6 mV to +21 mV in the CMP polishing slurry.