Patent Assignment
Reel/Frame 026671/0251
Assignment of Assignor's Interest
Recorded: 2011-07-29
Pages: 2
Assignors
MISHIMA, KOUJI
Executed: 2011-07-06
SAKURADA, TAKAFUMI
Executed: 2011-07-06
SHIMADA, TOMOKAZU
Executed: 2011-07-06
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Cmp Polishing Solution and Polishing Method
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Feb 28, 2018
From: HITACHI CHEMICAL COMPANY, LTD
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 045470/0229 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →