IP Library Assignment 045470/0229
Patent Assignment
Reel/Frame 045470/0229

Change of Address

Recorded: 2018-02-28 Pages: 2
Assignor
HITACHI CHEMICAL COMPANY, LTD
Executed: 2018-02-28
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 1006606, JAPAN
Covered Property (1)
Cmp Polishing Solution and Polishing Method
Patent: 9,944,827 →
Application: 13/172,397 →
Publication: US 2011/0318929
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 29, 2011
From: MISHIMA, KOUJI; SAKURADA, TAKAFUMI; SHIMADA, TOMOKAZU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 026671/0251 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →