IP Library Granted Patent US 10,557,058
Granted Patent B2
US 10,557,058 · App. 14/379,954 · Granted Feb 11, 2020

Polishing agent, polishing agent set, and substrate polishing method

Inventors: Toshiaki Akutsu (Hitachi, JP); Hisataka Minami (Hitachi, JP); Tomohiro Iwano (Hitachi, JP); Koji Fujisaki (Kokubunji, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
C09G1/02C09K3/1409C09K3/1436C09K3/1463H01L21/30625H01L21/31053H01L21/76224
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Quick Facts
Patent No.
US 10,557,058
App. No.
14/379,954
Granted
Feb 11, 2020
Kind
B2
Abstract

The polishing agent of the invention comprises water, an abrasive grain containing a hydroxide of a tetravalent metal element, polyalkylene glycol, and at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers.

Claims (32)

1. A polishing agent comprising:

water,

abrasive grains containing a hydroxide of a tetravalent metal element,

at least one polyalkylene glycol, and

at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers,

wherein the abrasive grains produce absorbance of 1.000 or greater for light with a wavelength of 290 nm in an aqueous dispersion having the abrasive grain content adjusted to 0.0065 mass %.

2. The polishing agent according to claim 1 , wherein

a content of the abrasive grains is 0.005 mass % or greater and 20 mass % or less based on a total mass of the polishing agent,

a content of the at least one polyalkylene glycol is 0.01 mass % or greater and 5 mass % or less based on the total mass of the polishing agent, and

a ratio of a content of the at least one cationic polymer with respect to a content of the at least one polyalkylene glycol is 0.0005 or greater and 0.03 or less in terms of mass ratio.

3. The polishing agent according to claim 2 , wherein the at least one cationic polymer is at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, and ethyleneimine polymers.

4. A polishing method for a base substrate, comprising a step of polishing a surface to be polished of a base substrate using the polishing agent according to claim 1 .

5. A polishing agent set comprising constituent components of the polishing agent according to claim 1 stored as separate liquids,

a first liquid containing the abrasive grains, and

a second liquid containing at least one selected from the group consisting of the at least one polyalkylene glycol and the at least one cationic polymer.

6. A polishing method for a base substrate, comprising a step of polishing a surface to be polished of a base substrate using a polishing agent obtained by mixing the first liquid and the second liquid of the polishing agent set according to claim 5 .

7. A polishing agent comprising:

water,

abrasive grains containing a hydroxide of a tetravalent metal element,

at least one polyalkylene glycol, and

at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers,

wherein the abrasive grains produce light transmittance of 50%/cm or greater for light with a wavelength of 500 nm in an aqueous dispersion having the abrasive grain content adjusted to 1.0 mass %.

8. The polishing agent according to claim 7 , wherein

a content of the abrasive grains is 0.005 mass % or greater and 20 mass % or less based on a total mass of the polishing agent,

a content of the at least one polyalkylene glycol is 0.01 mass % or greater and 5 mass % or less based on the total mass of the polishing agent, and

a ratio of a content of the at least one cationic polymer with respect to a content of the at least one polyalkylene glycol is 0.0005 or greater and 0.03 or less in terms of mass ratio.

9. The polishing agent according to claim 8 , wherein the at least one cationic polymer is at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, and ethyleneimine polymers.

10. A polishing method for a base substrate, comprising a step of polishing a surface to be polished of a base substrate using the polishing agent according to claim 7 .

11. A polishing agent set comprising constituent components of the polishing agent according to claim 7 stored as separate liquids,

a first liquid containing the abrasive grains, and

a second liquid containing at least one selected from the group consisting of the at least one polyalkylene glycol and the at least one cationic polymer.

12. A polishing method for a base substrate, comprising a step of polishing a surface to be polished of a base substrate using a polishing agent obtained by mixing the first liquid and the second liquid of the polishing agent set according to claim 11 .

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 9, 2014
From: AKUTSU, TOSHIAKI; MINAMI, HISATAKA; IWANO, TOMOHIRO; FUJISAKI, KOJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 033924/0369 →
Priority Claims (1)
JP 2012-035432 · Feb 21, 2012 · national
Continuity (1)
Related Publication 20150017806A1 · Jan 15, 2015