Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection

1. A method for manufacturing an electronic component having an electromagnetic shield, the method comprising:

a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof;

a photocuring step of curing the temporary protective material by light irradiation;

a dicing step of singulating the workpiece and the temporary protective material;

a shielding step of forming a metal film on a portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and

a peeling step of peeling the temporary protective material from the workpiece having the metal film formed,

wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm 2 or more.

2. The method according to claim 1 , wherein the resin composition has a tack force of 1 to 5 N as measured at 25° C. by a probe tack test after light irradiation with an exposure dose of 500 mJ/cm 2 or more.

3. The method according to claim 1 , wherein the resin composition comprises a (meth)acrylic copolymer (A), and the (meth)acrylic copolymer comprises a (meth)acrylic monomer (α1) and a (meth)acrylic monomer (α2) as copolymer components, a homopolymer of the (meth)acrylic monomer (α1) having a glass transition temperature of 50° C. or more and a homopolymer of the (meth)acrylic monomer (α2) having a glass transition temperature of 0° C. or less.

4. The method according to claim 3 , wherein a weight average molecular weight of the (meth)acrylic copolymer (A) is 100000 to 1000000.

5. The method according to claim 1 , wherein the resin composition further comprises a (meth)acrylic monomer (B).

6. The method according to claim 1 , wherein the resin composition further comprises a photoradical polymerization initiator (C).

7. The method according to claim 1 , wherein the resin composition further comprises a silicone compound (D).

8. The method according to claim 1 , wherein the resin composition further comprises a thermally curable component (E), and the component (E) is liquid at room temperature.

9. The method according to claim 1 , further comprising a thermally curing step of further curing the temporary protective material by heating after the dicing step.

10. The method according to claim 1 , wherein the temporary protective material is in the form of a film.

11. A resin composition for temporary protection, the resin composition being for forming the temporary protective material and used for a method for manufacturing an electronic component having an electromagnetic shield, the method comprising:

a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof;

a photocuring step of curing the temporary protective material by light irradiation;

a dicing step of singulating the workpiece and the temporary protective material;

a shielding step of forming a metal film on a portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and

the peeling step of peeling the temporary protective material from the workpiece having the metal film formed,

wherein the resin composition has an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm 2 or more.

12. The resin composition for temporary protection according to claim 11 , wherein the resin composition has a tack force of 1 to 5 N as measured at 25° C. by a probe tack test after light irradiation with an exposure dose of 500 mJ/cm 2 or more.

13. The resin composition for temporary protection according to claim 11 , wherein the resin composition comprises a (meth)acrylic copolymer (A), and the (meth)acrylic copolymer comprises a (meth)acrylic monomer (α1) and a (meth)acrylic monomer (α2) as copolymer components, a homopolymer of the (meth)acrylic monomer (α1) having a glass transition temperature of 50° C. or more and a homopolymer of the (meth)acrylic monomer (α2) having a glass transition temperature of 0° C. or less.

14. The resin composition for temporary protection according to claim 13 , wherein a weight average molecular weight of the (meth)acrylic copolymer (A) is 100000 to 1000000.

15. The resin composition for temporary protection according to claim 11 , further comprising a (meth)acrylic monomer (B).

16. The resin composition for temporary protection according to claim 11 , further comprising a photoradical polymerization initiator (C).

17. The resin composition for temporary protection according to claim 11 , further comprising a silicone compound (D).

18. The resin composition for temporary protection according to claim 11 , further comprising a thermally curable component (E), wherein the component (E) is liquid at room temperature.

19. The resin composition for temporary protection according to claim 11 , wherein the method further comprises a thermally curing step of further curing the temporary protective material by heating after the dicing step.

20. A resin film for temporary protection, obtained by forming the resin composition according to claim 11 into a film.