Patent Assignment
Reel/Frame 050220/0465
Assignment of Assignor's Interest
Recorded: 2019-08-30
Pages: 4
Assignors
YAMAGUCHI, YUSHI
Executed: 2019-07-11
FURUTANI, RYOJI
Executed: 2019-07-16
IKEYA, TAKUJI
Executed: 2019-07-26
SOBUE, SHOGO
Executed: 2019-07-11
OOYAMA, YASUYUKI
Executed: 2019-07-16
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component, Resin Composition for Temporary Protection, and Resin Film for Temporary Protection
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →