Prepreg and printed wiring board using thin quartz glass cloth
View Patent ↗It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.
1. A prepreg, obtained by compositing a quartz glass cloth and a thermosetting resin composition,
the quartz glass cloth being fabricated using a quartz yarn comprising 15 to 49 quartz glass fibers having a filament diameter of 5 to 9 μm, and having weaving densities of warp yarn and weft yarn each of 30 to 70 yarns/25 mm,
the thermosetting resin composition after curing having a dielectric loss tangent of 0.003 or less,
wherein the prepreg has a thickness of 30 to 60 μm.
2. The prepreg according to claim 1 , wherein the prepreg has a content of the thermosetting resin composition of 50 to 80% by weight.
3. The prepreg according to claim 1 , wherein the thermosetting resin composition comprises:
at least one crosslinking component selected from a polybutadiene represented by the formula (1), a polyfunctional styrene compound represented by the formula (2), a bismaleimide compound represented by the formula (3) and a thermosetting polyphenylene ether;
a hydrogenated styrene-butadiene copolymer;
a silicon oxide filler; and
a flame retardant having a structure represented by the formula (4) or the formula (5):
wherein R represents a hydrocarbon skeleton; R 1 s are the same or different, and represent hydrogen or a hydrocarbon group having 1 to 20 carbon atoms; R 2 , R 3 and R 4 are the same or different, and represent hydrogen or a hydrocarbon group having 1 to 6 carbon atoms; m is an integer of 1 to 4, and n is an integer of 2 or more; and a polyfunctional styrene compound represented by the formula (2) has a weight-average molecular weight in terms of polystyrene of 1,000 or less,
wherein R 5 s are the same or different, and represent a hydrocarbon group having 1 to 4 carbon atoms; and I represents an integer of 1 to 4,
4. A prepreg, obtained by compositing a quartz glass cloth and a thermosetting resin composition,
the quartz glass cloth being fabricated using a quartz yarn comprising a quartz glass fiber as a main component, and having a low fiber density of the quartz glass fiber,
the thermosetting resin composition after curing having a dielectric loss tangent of 0.003 or less,
wherein the prepreg has a thickness of 30 to 60 μm, and
wherein the thermosetting resin composition comprises:
at least one crosslinking component selected from a polybutadiene represented by the formula (1), a polyfunctional styrene compound represented by the formula (2), a bismaleimide compound represented by the formula (3) and a thermosetting polyphenylene ether;
a hydrogenated styrene-butadiene copolymer;
a silicon oxide filler; and
a flame retardant having a structure represented by the formula (4) or the formula (5):
wherein R represents a hydrocarbon skeleton; R 1 s are the same or different, and represent hydrogen or a hydrocarbon group having 1 to 20 carbon atoms; R 2 , R 3 and R 4 are the same or different, and represent hydrogen or a hydrocarbon group having 1 to 6 carbon atoms; m is an integer of 1 to 4, and n is an integer of 2 or more; and a polyfunctional styrene compound represented by the formula (2) has a weight-average molecular weight in terms of polystyrene of 1,000 or less,
wherein R 5 s are the same or different, and represent a hydrocarbon group having 1 to 4 carbon atoms; and I represents an integer of 1 to 4,
5. The prepreg according to claim 4 , wherein the thermosetting resin composition further comprises a polymerization inhibitor or a polymerization initiator.
6. The prepreg according to claim 4 , wherein a cured product of the thermosetting resin composition has a thermal expansion coefficient at 50 to 100° C. of 50 ppm/° C. or less.
7. The prepreg according to claim 4 , wherein a cured product of the thermosetting resin composition has a storage elastic modulus at 20° C. of 300 to 1,700 MPa.
8. A laminate, comprising a conductor layer(s) on both surfaces or one surface of an insulating layer made of a cured product of the prepreg according to claim 1 .
9. The laminate according to claim 8 , wherein the insulating layer has a thickness of 10 to 50 μm.
10. A printed wiring board, comprising a conductor wiring(s) on both surfaces or one surface of an insulating layer made of a cured product of the prepreg according to claim 1 .
11. The printed wiring board according to claim 10 , wherein the insulating layer has a thickness of 10 to 50 μm.
12. A multilayer printed wiring board, obtained by laminating a plurality of insulating layers made of a cured product of the prepreg according to claim 1 with a conductor wiring layer interposed between two insulating layers.
13. A multilayer printed wiring board, obtained by laminating a plurality of insulating layers made of a cured product of a prepreg with a conductor wiring layer interposed between two insulating layers, wherein said prepreg is obtained by compositing a quartz glass cloth and a thermosetting resin composition,
the quartz glass cloth being fabricated using a quartz yarn comprising a quartz glass fiber as a main component, and having a low fiber density of the quartz glass fiber,
the thermosetting resin composition after curing having a dielectric loss tangent of 0.003 or less,
wherein the prepreg has a thickness of 30 to 60 μm.
14. The multilayer printed wiring board according to claim 13 , wherein the insulating layer has a thickness of 10 μm to 50 μm.
15. An electronic component having a circuit to transmit an electric signal of 1 GHz or more, the electronic component comprising a cured product of the prepreg according to claim 1 used as an insulating layer of the electronic component.
16. The prepreg according to claim 1 , wherein said quartz yarn comprises 15 to 40 quartz glass fibers having a filament diameter of 5 to 9 μm.
17. The prepreg according to claim 1 , wherein the thermosetting resin composition after curing has a dielectric loss tangent of 0.003 or less at 10 GHz.
18. The prepreg according to claim 1 , wherein the quartz glass cloth has a weight per unit area of 10 to 18 g/m 2 .
19. The prepreg according to claim 1 , wherein the quartz glass cloth has a thickness of 15 to 30 μm.