IP Library › Granted Patent US 804,435
Granted Patent S1
US 804,435 · App. 29/491,391 · Granted Dec 5, 2017

Flap in an adhesive tape for semiconductor manufacturing

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 804,435
App. No.
29/491,391
Granted
Dec 5, 2017
Kind
S1
Claims (1)

The ornamental design for a flap in an adhesive tape for semiconductor manufacturing, as shown and described.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 24, 2017
From: TANIGUCHI, KOUHEI; MATSUZAKI, TAKAYUKI; KATOU, SHINYA; KOMORIDA, KOUJI; MASHINO, MICHIO; SAKUTA, TATSUYA; KATOU, RIE
To: HITACHI CHEMICAL COMPANY LTD.
Reel/Frame 043930/0579 →