Patent Assignment
Reel/Frame 043930/0579
Assignment of Assignor's Interest
Recorded: 2017-10-24
Pages: 4
Assignors
TANIGUCHI, KOUHEI
Executed: 2011-07-11
MATSUZAKI, TAKAYUKI
Executed: 2011-07-11
KATOU, SHINYA
Executed: 2011-07-11
KOMORIDA, KOUJI
Executed: 2011-07-11
MASHINO, MICHIO
Executed: 2011-07-11
SAKUTA, TATSUYA
Executed: 2011-07-11
KATOU, RIE
Executed: 2011-07-11
Assignee
HITACHI CHEMICAL COMPANY LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Flap in an Adhesive Tape for Semiconductor Manufacturing
Patent:
804,435 →
Application:
29/491,391 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →