Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) with respect to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
1. A printed wiring board comprising at least a prepreg formed by impregnating a fiber base material with a resin composition, wherein:
the resin composition comprises a thermosetting resin, a curing agent, and an acrylic resin obtained by polymerizing a monomer mixture, a mixing ratio of the thermosetting resin being 10-90 wt % with respect to the total solid portion of the resin composition,
the monomer mixture consisting of:
5-30 parts by weight of a compound represented by the following formula (1),
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl or C6-13 cycloalkylalkyl group;
0.5-30 parts by weight of a functional group-containing monomer, the functional group comprising at least one of an acid anhydride group, an amino group, an amide group or an epoxy group; and
40-94.5 parts by weight of a third monomer that is copolymerizable with the functional group-containing monomer and the compound represented by formula (1) and has no nitrile groups in the structure, wherein the third monomer is at least one monomer selected from the group consisting of methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, i-butyl acrylate, t-butyl acrylate, pentyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, dodecyl acrylate, octadecyl acrylate, butoxyethyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, t-butyl methacrylate, pentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, lauryl methacrylate, dodecyl methacrylate, octadecyl methacrylate, butoxyethyl methacrylate, 4-vinylpyridine, 2-vinylpyridine, α-methylstyrene, α-ethylstyrene, α-fluorostyrene, α-chlorostyrene, α-bromostyrene, fluorostyrene, chlorostyrene, bromostyrene, methylstyrene, methoxystyrene and styrene,
the amounts of the compound represented by formula (1), the functional group-containing monomer and the third monomer combine to a total amount of 100 parts by weight, and
the ratio of the peak height near 2240 cm −1 due to nitrile groups (P CN ) to the peak height near 1730 cm −1 due to carbonyl groups (P CO ) in the IR spectrum of the cured resin composition (P CN /P CO ) is no greater than 0.001.
2. The printed wiring board according to claim 1 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1).
3. The printed wiring board according to claim 1 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl.
4. The printed wiring board according to claim 1 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000.
5. A printed wiring board comprising at least a prepreg formed by impregnating a fiber base material with a resin composition, wherein:
the resin composition comprises a thermosetting resin, a curing agent, and an acrylic resin, a mixing ratio of the thermosetting resin being 10-90 wt % with respect to the total solid portion of the resin composition, the acrylic resin being an acrylic resin obtained by polymerizing a monomer mixture consisting of:
5-30 parts by weight of a compound represented by the following formula (1):
wherein R 1 represents a hydrogen atom or a methyl group and R 2 represents a C5-10 cycloalkyl or C6-13 cycloalkylalkyl group,
0.5-30 parts by weight of a functional group-containing monomer having a functional group comprising at least one of an acid anhydride group, an amino group, an amide group or an epoxy group, and
40-94.5 parts by weight of another monomer that is copolymerizable with these components and has no nitrile groups in the structure, wherein the another monomer is at least one monomer selected from the group consisting of methyl acrylate, ethyl acrylate, n-propyl acrylate, i-propyl acrylate, n-butyl acrylate, i-butyl acrylate, t-butyl acrylate, pentyl acrylate, n-hexyl acrylate, 2-ethylhexyl acrylate, n-octyl acrylate, dodecyl acrylate, octadecyl acrylate, butoxyethyl acrylate, methyl methacrylate, ethyl methacrylate, n-propyl methacrylate, i-propyl methacrylate, n-butyl methacrylate, i-butyl methacrylate, t-butyl methacrylate, pentyl methacrylate, n-hexyl methacrylate, 2-ethylhexyl methacrylate, n-octyl methacrylate, lauryl methacrylate, dodecyl methacrylate, octadecyl methacrylate, butoxyethyl methacrylate, 4-vinylpyridine, 2-vinylpyridine, α-methylstyrene, α-ethylstyrene, α-fluorostyrene, α-chlorostyrene, α-bromostyrene, fluorostyrene, chlorostyrene, bromostyrene, methylstyrene, methoxystyrene and styrene, and
the compound represented by the formula (1), the functional group-containing monomer, and the another monomer are combined to a total amount of 100 parts by weight.
6. The printed wiring board according to claim 5 , wherein the acrylic resin is one employing a methacrylic acid ester or acrylic acid ester having a C5-10 cycloalkyl group in the ester portion, as the compound represented by formula (1).
7. The printed wiring board according to claim 6 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of cyclohexyl, norbornyl, tricyclodecanyl, isobornyl and adamantyl.
8. The printed wiring board according to claim 5 , wherein the weight-average molecular weight (Mw) of the acrylic resin is 50,000-1,500,000.
9. The printed wiring board according to claim 1 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of norbornyl, tricyclodecanyl, and adamantyl.
10. The printed wiring board according to claim 5 , wherein the C5-10 cycloalkyl group contains at least one group selected from the group consisting of norbornyl, tricyclodecanyl, and adamantyl.