IP Library Granted Patent US 10,030,172
Granted Patent B2
US 10,030,172 · App. 15/108,001 · Granted Jul 24, 2018

Abrasive, abrasive set, and method for polishing substrate

Inventors: Hisataka Minami (Tokyo, JP); Tomohiro Iwano (Tokyo, JP); Toshiaki Akutsu (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
C09G1/02B24B37/044C09K3/1409C09K3/1472H01L21/31053
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Quick Facts
Patent No.
US 10,030,172
App. No.
15/108,001
Granted
Jul 24, 2018
Kind
B2
Abstract

A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.

Claims (54)

1. A method for polishing a base comprising an insulating material and a stopper material, comprising a step of polishing a surface to be polished of a base using a polishing agent comprising:

a fluid medium;

abrasive grains containing a hydroxide of a tetravalent metal element;

a first additive;

a second additive; and

a third additive,

wherein:

the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer;

the second additive is a cationic polymer;

the third additive is an amino group-containing sulfonic acid compound;

the insulating material contains silicon dioxide; and

the stopper material contains polysilicon.

2. A method for polishing a base comprising an insulating material and a stopper material, the method comprising a step of polishing a surface to be polished of the base using a polishing agent comprising:

a fluid medium;

abrasive grains containing a hydroxide of a tetravalent metal element;

a first additive;

a second additive; and

a third additive,

wherein:

the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer;

the second additive is a cationic polymer; and

the third additive is an amino group-containing sulfonic acid compound;

wherein the insulating material contains silicon dioxide and the stopper material contains polysilicon; and

wherein the polishing agent is obtained from a polishing agent set comprising constituent components of the polishing agent stored as separate liquids containing a first liquid and a second liquid, wherein the first liquid contains the abrasive grains, and the second liquid contains at least one selected from the group consisting of the first additive, the second additive and the third additive, and the polishing agent is obtained by mixing at least the first liquid and the second liquid.

3. A method for polishing a base comprising an insulating material and a stopper material,

the method comprising a step of selectively polishing the insulating material with respect to the stopper material using a polishing agent comprising:

a fluid medium;

abrasive grains containing a hydroxide of a tetravalent metal element;

a first additive;

a second additive; and

a third additive,

wherein:

the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer;

the second additive is a cationic polymer;

the third additive is an amino group-containing sulfonic acid compound;

the insulating material contains silicon dioxide; and

the stopper material contains polysilicon.

4. A method for polishing a base comprising an insulating material and a stopper material,

the method comprising a step of selectively polishing the insulating material with respect to the stopper material using a polishing agent comprising:

a fluid medium;

abrasive grains containing a hydroxide of a tetravalent metal element;

a first additive;

a second additive; and

a third additive,

wherein:

the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer;

the second additive is a cationic polymer; and

the third additive is an amino group-containing sulfonic acid compound;

wherein the insulating material contains silicon dioxide and the stopper material contains polysilicon; and

wherein the polishing agent is obtained from a polishing agent set comprising constituent components of the polishing agent stored as separate liquids containing a first liquid and a second liquid, wherein the first liquid contains the abrasive grains, and the second liquid contains at least one selected from the group consisting of the first additive, the second additive and the third additive, and the polishing agent is obtained by mixing the first liquid and the second liquid.

5. The method according to claim 3 , wherein the second additive is at least one selected from the group consisting of an allylamine polymer, a diallylamine polymer, a vinylamine polymer and an ethyleneimine polymer.

6. The method according to claim 3 , wherein the third additive is at least one selected from the group consisting of sulfamic acid, an aliphatic aminosulfonic acid, an aromatic aminosulfonic acid and their salts.

7. The method according to claim 3 , wherein a content of the third additive is 0.0005 mass % or more and 0.2 mass % or less based on a total mass of the polishing agent.

8. The method according to claim 3 , wherein the hydroxide of a tetravalent metal element contains at least one hydroxide ion and at least one anion other that a hydroxide ion bonded to the tetravalent metal element.

Assignments (4)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2017
From: MINAMI, HISATAKA; IWANO, TOMOHIRO; AKUTSU, TOSHIAKI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 042812/0083 →
Priority Claims (1)
JP 2013-268956 · Dec 26, 2013 · national
Continuity (1)
Related Publication 20160319159A1 · Nov 3, 2016