Prepreg for coreless substrate, coreless substrate and semiconductor package
The present invention provides a prepreg for a coreless substrate and a coreless substrate and a semiconductor package using the prepreg, which can satisfy heat resistance, low thermal expansion, and bonding strength with a metal circuit at a level required for the coreless substrate. Specifically, the prepreg for a coreless substrate contains a thermosetting resin composition containing (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two primary amino groups having at least two N-substituted maleimide groups. Instead of (c) the amine compound having at least two primary amino groups and (d) the maleimide compound, having at least two N-substituted maleimide groups, (X) an amino-modified polyimide resin obtained by reacting them may be used.
1. A prepreg for a coreless substrate, comprising a thermosetting resin composition and a fiber base material,
wherein the thermosetting resin composition contains (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, (c) an amine compound having at least two primary amino groups, and (d) a maleimide compound having at least two N-substituted maleimide groups, and the component (c) comprises both-terminal diamine-modified siloxane.
2. The prepreg for a coreless substrate according to claim 1 , wherein a content of the (a) dicyandiamide is 0.05 to 1.5 parts by mass with respect to 100 parts by mass of a solid content of a resin component in the thermosetting resin composition.
3. The prepreg for a coreless substrate according to claim 1 , wherein the thermosetting resin composition further contains at least one (e) thermosetting resin selected from the group consisting of an epoxy resin and a cyanate resin.
4. The prepreg for a coreless substrate according to claim 1 , wherein the thermosetting resin composition further contains (f) an inorganic filler.
5. A coreless substrate comprising an insulating layer comprising the prepreg for a coreless substrate according to claim 1 .
6. A semiconductor package comprising a semiconductor element mounted on the coreless substrate according to claim 5 .
7. A prepreg for a coreless substrate, comprising a thermosetting resin composition and a fiber base material,
wherein the thermosetting resin composition contains (a) dicyandiamide, (b) an adduct of a tertiary phosphine and quinones, and (X) an amino-modified polyimide resin, wherein the (X) amino-modified polyimide resin is a reaction product of (c) an amine compound having at least two primary amino groups in its molecular structure and (d) a maleimide compound having at least two N-substituted maleimide groups in its molecular structure, and the component (c) comprises both-terminal diamine-modified siloxane.
8. The prepreg for a coreless substrate according to claim 7 , wherein a content of the (a) dicyandiamide is 0.05 to 1.5 parts by mass with respect to 100 parts by mass of a solid content of a resin component in the thermosetting resin composition.
9. The prepreg for a coreless substrate according to claim 7 , wherein the thermosetting resin composition further contains at least one (e) thermosetting resin selected from the group consisting of an epoxy resin and a cyanate resin.
10. The prepreg for a coreless substrate according to claim 7 , wherein the thermosetting resin composition further contains (f) an inorganic filler.
11. A coreless substrate comprising an insulating layer comprising the prepreg for a coreless substrate according to claim 7 .
12. A semiconductor package comprising a semiconductor element mounted on the coreless substrate according to claim 11 .