Patent Assignment
Reel/Frame 061664/0128
Change of Name
Recorded: 2022-10-12
Pages: 52
Assignor
HITACHI CHEMICAL COMPANY, LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 31, 2020
From: YOKOTA, HIROSHI; HASHIMOTO, SHINTARO; SAKAMOTO, NORIHIKO; TSUCHIKAWA, SHINJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 051680/0813 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →