Photosensitive resin composition for protective film of printed wiring board for semiconductor package

1. A photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, the photosensitive resin composition comprising:

(A) an acid-modified vinyl group-containing epoxy resin;

(B) a phenol compound, wherein the phenol compound is a compound represented by formula (1) or formula (10),

wherein, in formula (1), R 1 represents a C 1 -C 5 alkyl group, m represents an integer of 1-4, n represents 3 and A is a trivalent organic group represented by formula (2), a plurality of R 1 groups may be the same or different,

wherein, in formula (10), R 3 , R 4 , R 5 and R 6 each independently represent a C 1 -C 5 alkyl group, and Z represents hydrogen or an organic group represented by formula (11),

wherein, in formula (11), R 7 and R 8 each independently represent a C 1 -C 5 alkyl group;

(C) a compound having at least one ethylenically unsaturated group in each molecule;

(D) a photopolymerization initiator; and

(E) inorganic fine particles including barium sulfate,

wherein the content of the phenol compound is 1.3-3 mass % based on the total solid mass of the photosensitive resin composition.

2. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , wherein, in formula (1), at least one R 1 is a tert-butyl group.

3. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , wherein the content of the (E) inorganic fine particles is 15-80 mass % based on the total solid mass of the photosensitive resin composition.

4. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , further comprising:

(F) a curing agent, wherein the (F) curing agent is a compound that cures under heat or ultraviolet rays, or a compound that cures upon reaction with the (A) acid-modified vinyl group-containing epoxy resin under heat or ultraviolet rays.

5. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , further comprising:

(G) an elastomer.

6. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , wherein the content of the barium sulfate is 10-60 mass % based on the total solid mass of the photosensitive resin composition.

7. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , wherein the content of the barium sulfate is 25-35 mass % based on the total solid mass of the photosensitive resin composition.

8. The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package according to claim 1 , wherein the acid-modified vinyl group-containing epoxy resin is a resin that is formable by reacting a saturated or unsaturated group-containing polybasic acid anhydride with a resin obtained by reacting a vinyl group-containing monocarboxylic acid with an epoxy resin that is a bisphenol-type novolac resin having a repeating unit represented by formula (7) or formula (8),

wherein, in formula (7), R 13 represents hydrogen or a methyl group, and Y 4 and Y 5 each independently represent hydrogen or a glycidyl group; the two R 13 may be the same or different; however at least one of Y 4 and Y 5 represents a glycidyl group;

wherein, in formula (8), R 14 represents hydrogen or a methyl group, and Y 6 and Y 7 each independently represent hydrogen or a glycidyl group; the two R 14 may be the same or different; however at least one of Y 6 and Y 7 represents a glycidyl group.

9. A photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, the photosensitive resin composition comprising:

(A) an acid-modified vinyl group-containing epoxy resin;

(B) a phenol compound, wherein the phenol compound is a compound represented by formula (1) or formula (10),

wherein, in formula (1), R 1 represents a C 1 -C 5 alkyl group, m represents an integer of 1-4, n represents 3 and A is a trivalent organic group represented by formula (2), a plurality of R 1 groups may be the same or different,

wherein, in formula (10), R 3 , R 4 , R 5 and R 6 each independently represent a C 1 -C 5 alkyl group, and Z represents hydrogen or an organic group represented by formula (11),

wherein, in formula (11), R 7 and R 8 each independently represent a C 1 -C 5 alkyl group;

(C) a compound having at least one ethylenically unsaturated group in each molecule;

(D) a photopolymerization initiator; and

(E) inorganic fine particles including barium sulfate,

wherein the content of the phenol compound is 1.3-3 mass % based on the total solid mass of the photosensitive resin composition,

wherein the (A) acid-modified vinyl group-containing epoxy resin is a resin obtained by reacting a saturated or unsaturated group-containing polybasic acid anhydride (c) with a resin obtained by reacting a vinyl group-containing monocarboxylic acid (b) with at least one type of epoxy resin (a) selected from the group consisting of novolac-type epoxy resins represented by the following formula (4), bisphenol-type epoxy resins represented by the following formula (5), salicylaldehyde-type epoxy resins represented by the following formula (6) and bisphenol-type novolac resins having a repeating unit represented by the following formula (7) or (8)

wherein in formula (4), R 11 represents hydrogen or a methyl group, Y 1 represents hydrogen or a glycidyl group, and n1 represents an integer of 1 or greater; a plurality of R 11 and Y 1 may be the same or different; however at least one Y 1 represents a glycidyl group;

wherein in formula (5), R 12 represents hydrogen or a methyl group, Y 2 represents hydrogen or a glycidyl group, and n2 represents an integer of 1 or greater; a plurality of R 12 may be the same or different; when n2 is 2 or greater, a plurality of Y 2 may be the same or different;

wherein in formula (6), Y 3 represents hydrogen or a glycidyl group, and n3 represents an integer of 1 or greater; a plurality of Y 3 may be the same or different, and however at least one Y 3 represents a glycidyl group;

wherein in formula (7), R 13 represents hydrogen or a methyl group, and Y 4 and Y 5 each independently represent hydrogen or a glycidyl group; the two R 13 may be the same or different; however at least one of Y 4 and Y 5 represents a glycidyl group;

wherein in formula (8), R 14 represents hydrogen or a methyl group, and Y 6 and Y 7 each independently represent hydrogen or a glycidyl group; the two R 14 may be the same or different; however at least one of Y 6 and Y 7 represents a glycidyl group.