Patent Assignment
Reel/Frame 026353/0352
Assignment of Assignor's Interest
Recorded: 2011-05-27
Pages: 3
Assignors
KURAFUCHI, KAZUHIKO
Executed: 2011-02-16
YOSHINO, TOSHIZUMI
Executed: 2011-02-16
KATAGI, HIDEYUKI
Executed: 2011-02-23
OKAWA, MASAYA
Executed: 2011-02-23
FUSE, YOSHIAKI
Executed: 2011-02-23
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Photosensitive Resin Composition for Protective Film of Printed Wiring Board for Semiconductor Package
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Apr 29, 2015
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 035531/0927 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →