IP Library Granted Patent US 10,113,090
Granted Patent B2
US 10,113,090 · App. 15/500,289 · Granted Oct 30, 2018

Adhesive composition

Inventor: Yuzuru Takahashi (Tokyo, JP)
Assignee: HITACHI CHEMICAL COMPANY, LTD.
C09J147/00C09J161/06
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Quick Facts
Patent No.
US 10,113,090
App. No.
15/500,289
Granted
Oct 30, 2018
Kind
B2
Abstract

The present invention relates to an adhesive composition comprising: 15 to 25 parts by weight of a 1-butene homopolymer; 12 to 22 parts by weight of an α-olefin copolymer having a melting point of 90° C. or higher; 30 to 50 parts by weight of a tackifier resin having a softening point of 125° C. or higher; 6 to 22 parts by weight of a polypropylene-based wax; and 4 to 20 parts by weight of a liquid hydrocarbon.

Claims (13)

1. An adhesive composition comprising:

15 to 25 parts by weight of a 1-butene homopolymer;

12 to 22 parts by weight of an α-olefin copolymer having a melting point of 90° C. or higher;

30 to 50 parts by weight of a tackifier resin having a softening point of 125° C. or higher;

6 to 22 parts by weight of a polypropylene-based wax; and

4 to 20 parts by weight of a liquid hydrocarbon.

2. The adhesive composition according to claim 1 , wherein the α-olefin copolymer is a 1-butene/α-olefin copolymer or a propylene/α-olefin copolymer.

3. The adhesive composition according to claim 1 , wherein the tackifier resin is at least one selected from a terpene-phenol resin and a hydrogenerated resin.

4. The adhesive composition according to claim 1 , wherein a peeling length is 10 mm or less when performing a test for creep resistant on heating under the condition of a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds.

5. The adhesive composition according to claim 2 , wherein the tackifier resin is at least one selected from a terpene-phenol resin and a hydrogenerated resin.

6. The adhesive composition according to claim 2 , wherein a peeling length is 10 mm or less when performing a test for creep resistant on heating under the condition of a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds.

7. The adhesive composition according to claim 3 , wherein a peeling length is 10 mm or less when performing a test for creep resistant on heating under the condition of a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds.

8. The adhesive composition according to claim 5 , wherein a peeling length is 10 mm or less when performing a test for creep resistant on heating under the condition of a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds.

Assignments (5)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
CHANGE OF NAME Recorded Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
CHANGE OF NAME Recorded Mar 8, 2022
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 059349/0591 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 30, 2017
From: TAKAHASHI, YUZURU
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 041122/0805 →
Priority Claims (1)
JP 2015-197672 · Oct 5, 2015 · national
Continuity (1)
Related Publication 20180208808A1 · Jul 26, 2018