Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board
Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.
1. An epoxy resin composition comprising:
hexagonal boron nitride particles having an aspect ratio of 2 or more;
a liquid crystalline epoxy monomer; and
a curing agent,
the epoxy resin composition forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, wherein, in the smectic domain, a periodic structure is formed in a direction intersecting with a (100) crystal face of a hexagonal boron nitride particle, and a periodic structure is formed in a direction along a (001) crystal face of the hexagonal boron nitride particle.
2. The epoxy resin composition according to claim 1 , wherein the liquid crystalline epoxy monomer comprises a monomer represented by the following Formula (I):
wherein, in Formula (I), each of R 1 to R 4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
3. The epoxy resin composition according to claim 1 , wherein the curing agent comprises a phenol novolak resin.
4. A thermally-conductive material precursor, comprising a semi-cured product of the epoxy resin composition according to claim 1 .
5. The thermally-conductive material precursor according to claim 4 , wherein the semi-cured product comprises a resin matrix having a smectic domain.
6. The thermally conductive material precursor according to claim 5 , wherein, in the smectic domain, a periodic structure is formed in a direction intersecting with a (100) crystal face of a hexagonal boron nitride particle, and a periodic structure is formed in a direction along a (001) crystal face of the hexagonal boron nitride particle.
7. The thermally-conductive material precursor according to claim 5 , wherein the smectic domain has a periodic structure having one cycle length of from 2 nm to 4 nm.
8. The epoxy resin composition according to claim 1 , wherein the hexagonal boron nitride particles have an aspect ratio of 2 to 7.
9. The epoxy resin composition according to claim 1 , wherein the smectic domain has a periodic structure having one cycle length of from 2 nm to 4 nm.
10. An epoxy resin composition comprising:
hexagonal boron nitride particles having an aspect ratio of 2 or more;
a liquid crystalline epoxy monomer; and
a curing agent,
the epoxy resin composition forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent,
wherein a content of the hexagonal boron nitride particles is 50% by mass or more with respect to a total solid content.
11. A B-stage sheet, comprising a sheet-shaped semi-cured product of the epoxy resin composition according to claim 10 .
12. The B-stage sheet according to claim 11 , wherein the semi-cured product comprises a resin matrix having a smectic domain.
13. The B-stage sheet according to claim 12 , wherein, in the smectic domain, a periodic structure is formed in a direction intersecting with a (100) crystal face of a hexagonal boron nitride particle, and a periodic structure is formed in a direction along a (001) crystal face of the hexagonal boron nitride particle.
14. The B-stage sheet according to claim 12 , wherein the smectic domain has a periodic structure having one cycle length of from 2 nm to 4 nm.
15. A heat dissipation material, comprising a cured product of the epoxy resin composition according to claim 10 .
16. A laminate comprising:
an adherend; and
a cured layer of at least one resin-containing layer selected from the group consisting of a resin layer formed from the epoxy resin composition according to claim 10 disposed on the adherend.
17. A printed circuit board comprising:
a wiring layer;
a metal plate; and
a cured layer disposed between the wiring layer and the metal plate, wherein the cured layer comprises a cured layer of at least one resin-containing layer formed from the epoxy resin composition according to claim 10 .
18. The epoxy resin composition according to claim 10 , wherein the liquid crystalline epoxy monomer comprises a monomer represented by the following Formula (I):
wherein, in Formula (I), each of R 1 to R 4 independently represents a hydrogen atom or an alkyl group having from 1 to 3 carbon atoms.
19. The epoxy resin composition according to claim 10 , wherein the curing agent comprises a phenol novolak resin.
20. A prepreg comprising:
a fiber substrate; and
a semi-cured product of an epoxy resin composition impregnated in the fiber substrate, the epoxy resin composition comprising:
hexagonal boron nitride particles having an aspect ratio of 2 or more;
a liquid crystalline epoxy monomer; and
a curing agent,
the epoxy resin composition forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent.
21. A metal substrate comprising:
a metal foil;
a metal plate; and
a cured layer of at least one resin-containing layer formed from an epoxy resin composition claim 1 disposed between the metal foil and the metal plate, the epoxy resin composition comprising:
hexagonal boron nitride particles having an aspect ratio of 2 or more;
a liquid crystalline epoxy monomer; and
a curing agent,
the epoxy resin composition forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent.