Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

1. A photosensitive resin composition, comprising:

(A) an alkali-soluble resin;

(B) a compound which generates an acid when exposed to light;

(C) a thermal crosslinking agent;

(D) an acryl resin;

(E) a nitrogen-containing aromatic compound represented by the following formula (1),

wherein R 1 represents a hydrogen atom or a hydrocarbon group; R 2 represents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

2. The photosensitive resin composition according to claim 1 , wherein the (E) component is a nitrogen-containing aromatic compound represented by the following formula (2):

wherein R 2 represents a hydrogen atom, an amino group or a phenyl group.

3. The photosensitive resin composition according to claim 2 , wherein the nitrogen-containing aromatic compound represented by the formula (2) is selected from the group consisting of 1H-tetrazole and 5-aminotetrazole.

4. The photosensitive resin composition according to claim 2 , wherein the nitrogen-containing aromatic compound represented by the formula (2) is 5-aminotetrazole.

5. The photosensitive resin composition according to claim 1 , wherein the (A) component is a phenol resin.

6. The photosensitive resin composition according to claim 5 , wherein the (A) component comprises a phenol resin (A1) having no unsaturated hydrocarbon group and a modified phenol resin (A2) having an unsaturated hydrocarbon group.

7. The photosensitive resin composition according to claim 6 , wherein the (A2) component is a modified phenol resin further modified by a reaction of a phenolic hydroxyl group with a polybasic acid anhydride.

8. The photosensitive resin composition according to claim 1 , wherein the (B) component is an o-quinone diazide compound.

9. The photosensitive resin composition according to claim 1 , further comprising (F) a silane compound represented by the following formula (3):

wherein R 3 represents a divalent organic group; and R 4 represents a monovalent organic group, and a plurality of R 4 in the same molecule may be identical or different.

10. The photosensitive resin composition according to claim 9 , wherein the silane compound represented by the formula (3) is 3-glycidoxypropyltrimethoxysilane.

11. A method for manufacturing a patterned cured film, the method comprising the steps of:

(1) applying and drying the photosensitive resin composition according to claim 1 on a substrate to thereby form a photosensitive resin film;

(2) exposing the photosensitive resin film;

(3) developing the photosensitive resin film after the exposure by using an alkali aqueous solution to thereby form a patterned resin film; and

(4) heating the patterned resin film.

12. An electronic component, having a patterned cured film obtained by the method according to claim 11 as a surface protecting layer or an interlayer insulating layer.

13. An electronic component, having a patterned cured film obtained by the method according to claim 11 as a cover coat layer, a core, a collar or an underfill.